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2006 1st Electronic Systemintegration Technology Conference
Latest Publications
TOTAL DOCUMENTS
239
(FIVE YEARS 0)
H-INDEX
12
(FIVE YEARS 0)
Published By IEEE
1424405521
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Transitioning to Lead-free: the Effect on Low Cycle Fatigue of Contaminating Solder Alloys
2006 1st Electronic Systemintegration Technology Conference
◽
10.1109/estc.2006.280041
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2006
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Author(s):
Christopher Hunt
◽
Martin Wickham
◽
Milos Dusek
Keyword(s):
Low Cycle Fatigue
◽
Lead Free
◽
Cycle Fatigue
◽
Solder Alloys
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Failure Detection of BGA Transition Structures at High Frequencies
2006 1st Electronic Systemintegration Technology Conference
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10.1109/estc.2006.279975
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2006
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Cited By ~ 6
Author(s):
J. Putaala
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O. Nousiainen
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H. Jantunen
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M. Moilanen
Keyword(s):
Failure Detection
◽
High Frequencies
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Transition Structures
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Technology Benchmarking of High Resolution Structures on LTCC for Microwave Circuits
2006 1st Electronic Systemintegration Technology Conference
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10.1109/estc.2006.279987
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2006
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Cited By ~ 15
Author(s):
J. Muller
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R. Perrone
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H. Thust
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K.-h. Drue
◽
C. Kutscher
◽
...
Keyword(s):
High Resolution
◽
Microwave Circuits
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Properties and Reliability Test of Anisotropic Conductive Film in Chip on Glass Package
2006 1st Electronic Systemintegration Technology Conference
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10.1109/estc.2006.279977
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2006
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Cited By ~ 1
Author(s):
Kai-chi Chen
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Hsun-tien Li
◽
Chia-wen Hsu
◽
Ching-ping Yang
Keyword(s):
Reliability Test
◽
Anisotropic Conductive Film
◽
Conductive Film
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Predicting the Shear Strength of a Wire Bond Using Laser Vibration Measurements
2006 1st Electronic Systemintegration Technology Conference
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10.1109/estc.2006.280091
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2006
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Cited By ~ 14
Author(s):
Holger Gaul
◽
Martin Schneider-Ramelow
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Klaus-dieter Lang
◽
Herbert Reichl
Keyword(s):
Shear Strength
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Vibration Measurements
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Wire Bond
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Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy
2006 1st Electronic Systemintegration Technology Conference
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10.1109/estc.2006.279993
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2006
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Cited By ~ 2
Author(s):
C. Andersson
◽
L. Liu
◽
J. Liu
Keyword(s):
Mechanical Properties
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Lead Free
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Electronics Packaging for Microfluidics Applications
2006 1st Electronic Systemintegration Technology Conference
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10.1109/estc.2006.280059
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2006
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Cited By ~ 1
Author(s):
Steffen Howitz
◽
Lars Rebenklau
◽
Andreas Richter
Keyword(s):
Electronics Packaging
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Thin Film Encapsulation for Secondary Batteries on Wafer Level
2006 1st Electronic Systemintegration Technology Conference
◽
10.1109/estc.2006.280196
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2006
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Cited By ~ 2
Author(s):
K. Marquardt
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R. Hahn
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T. Luger
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H. Reichl
Keyword(s):
Thin Film
◽
Wafer Level
◽
Thin Film Encapsulation
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Design Considerations of Small Size Reflective Type Pulse Oximeter Heads in Special Applications
2006 1st Electronic Systemintegration Technology Conference
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10.1109/estc.2006.280034
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2006
◽
Cited By ~ 3
Author(s):
Hunor Santha
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Norbert Stuban
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Gabor Harsanyi
Keyword(s):
Pulse Oximeter
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Design Considerations
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Packaging Parameter Analysis on Solder Joint Reliability for Twin Die Stacked Packages by Variance in Strain Energy Density of Each Solder Joint
2006 1st Electronic Systemintegration Technology Conference
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10.1109/estc.2006.280123
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2006
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Cited By ~ 2
Author(s):
Chao-yang Mao
◽
Rong-sheng Chen
Keyword(s):
Energy Density
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Solder Joint
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Strain Energy Density
◽
Strain Energy
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Parameter Analysis
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Solder Joint Reliability
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Joint Reliability
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