2006 1st Electronic Systemintegration Technology Conference
Latest Publications

TOTAL DOCUMENTS

239

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

1424405521

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Predicting the Shear Strength of a Wire Bond Using Laser Vibration Measurements

2006 1st Electronic Systemintegration Technology Conference ◽

10.1109/estc.2006.280091 ◽

2006 ◽

Cited By ~ 14

Author(s):

Holger Gaul ◽

Martin Schneider-Ramelow ◽

Klaus-dieter Lang ◽

Herbert Reichl

Keyword(s):

Shear Strength ◽

Vibration Measurements ◽

Wire Bond

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Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy

2006 1st Electronic Systemintegration Technology Conference ◽

10.1109/estc.2006.279993 ◽

2006 ◽

Cited By ~ 2

Author(s):

C. Andersson ◽

L. Liu ◽

J. Liu

Keyword(s):

Mechanical Properties ◽

Lead Free

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Properties and Reliability Test of Anisotropic Conductive Film in Chip on Glass Package

2006 1st Electronic Systemintegration Technology Conference ◽

10.1109/estc.2006.279977 ◽

2006 ◽

Cited By ~ 1

Author(s):

Kai-chi Chen ◽

Hsun-tien Li ◽

Chia-wen Hsu ◽

Ching-ping Yang

Keyword(s):

Reliability Test ◽

Anisotropic Conductive Film ◽

Conductive Film

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Transitioning to Lead-free: the Effect on Low Cycle Fatigue of Contaminating Solder Alloys

2006 1st Electronic Systemintegration Technology Conference ◽

10.1109/estc.2006.280041 ◽

2006 ◽

Author(s):

Christopher Hunt ◽

Martin Wickham ◽

Milos Dusek

Keyword(s):

Low Cycle Fatigue ◽

Lead Free ◽

Cycle Fatigue ◽

Solder Alloys

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Failure Detection of BGA Transition Structures at High Frequencies

2006 1st Electronic Systemintegration Technology Conference ◽

10.1109/estc.2006.279975 ◽

2006 ◽

Cited By ~ 6

Author(s):

J. Putaala ◽

O. Nousiainen ◽

H. Jantunen ◽

M. Moilanen

Keyword(s):

Failure Detection ◽

High Frequencies ◽

Transition Structures

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Technology Benchmarking of High Resolution Structures on LTCC for Microwave Circuits

2006 1st Electronic Systemintegration Technology Conference ◽

10.1109/estc.2006.279987 ◽

2006 ◽

Cited By ~ 15

Author(s):

J. Muller ◽

R. Perrone ◽

H. Thust ◽

K.-h. Drue ◽

C. Kutscher ◽

...

Keyword(s):

High Resolution ◽

Microwave Circuits

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Electronics Packaging for Microfluidics Applications

2006 1st Electronic Systemintegration Technology Conference ◽

10.1109/estc.2006.280059 ◽

2006 ◽

Cited By ~ 1

Author(s):

Steffen Howitz ◽

Lars Rebenklau ◽

Andreas Richter

Keyword(s):

Electronics Packaging

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Thin Film Encapsulation for Secondary Batteries on Wafer Level

2006 1st Electronic Systemintegration Technology Conference ◽

10.1109/estc.2006.280196 ◽

2006 ◽

Cited By ~ 2

Author(s):

K. Marquardt ◽

R. Hahn ◽

T. Luger ◽

H. Reichl

Keyword(s):

Thin Film ◽

Wafer Level ◽

Thin Film Encapsulation

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Design Considerations of Small Size Reflective Type Pulse Oximeter Heads in Special Applications

2006 1st Electronic Systemintegration Technology Conference ◽

10.1109/estc.2006.280034 ◽

2006 ◽

Cited By ~ 3

Author(s):

Hunor Santha ◽

Norbert Stuban ◽

Gabor Harsanyi

Keyword(s):

Pulse Oximeter ◽

Design Considerations

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Packaging Parameter Analysis on Solder Joint Reliability for Twin Die Stacked Packages by Variance in Strain Energy Density of Each Solder Joint

2006 1st Electronic Systemintegration Technology Conference ◽

10.1109/estc.2006.280123 ◽

2006 ◽

Cited By ~ 2

Author(s):

Chao-yang Mao ◽

Rong-sheng Chen

Keyword(s):

Energy Density ◽

Solder Joint ◽

Strain Energy Density ◽

Strain Energy ◽

Parameter Analysis ◽

Solder Joint Reliability ◽

Joint Reliability

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2006 1st Electronic Systemintegration Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Predicting the Shear Strength of a Wire Bond Using Laser Vibration Measurements

Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy

Properties and Reliability Test of Anisotropic Conductive Film in Chip on Glass Package

Transitioning to Lead-free: the Effect on Low Cycle Fatigue of Contaminating Solder Alloys

Failure Detection of BGA Transition Structures at High Frequencies

Technology Benchmarking of High Resolution Structures on LTCC for Microwave Circuits

Electronics Packaging for Microfluidics Applications

Thin Film Encapsulation for Secondary Batteries on Wafer Level

Design Considerations of Small Size Reflective Type Pulse Oximeter Heads in Special Applications

Packaging Parameter Analysis on Solder Joint Reliability for Twin Die Stacked Packages by Variance in Strain Energy Density of Each Solder Joint

2006 1st Electronic Systemintegration Technology Conference
Latest Publications