Investigation on the sawing temperature in ultrasonic vibration assisted diamond wire sawing monocrystalline silicon

2021 ◽  
Vol 135 ◽  
pp. 106070
Author(s):  
Yan Wang ◽  
Li-Xing Song ◽  
Jian-Guo Liu ◽  
Rui Wang ◽  
Bo-Cheng Zhao
Keyword(s):  
Ultrasonic Vibration ◽  
Monocrystalline Silicon ◽  
Diamond Wire ◽  
Diamond Wire Sawing

scholarly journals Experimental Investigation of the Sawn Surface of Monocrystalline Silicon Cut by Endless Diamond Wire Sawing

2020 ◽  
Vol 23 (4) ◽  
Author(s):  
Erick Cardoso Costa ◽  
Caroline Piesanti dos Santos ◽  
Fabio Antonio Xavier ◽  
Walter Lindolfo Weingaertner
Keyword(s):  
Experimental Investigation ◽  
Monocrystalline Silicon ◽  
Diamond Wire ◽  
Diamond Wire Sawing

INFLUENCE OF DIAMOND WIRE SAWING PARAMETERS ON SUBSURFACE MICROCRACKS FORMATION IN MONOCRYSTALLINE SILICON WAFER

2019 ◽  
Author(s):  
Erick Cardoso Costa ◽  
Caroline Piesanti dos Santos ◽  
Fabio Antonio Xavier ◽  
Walter Lindolfo Weingaertner
Keyword(s):  
Silicon Wafer ◽  
Monocrystalline Silicon ◽  
Diamond Wire ◽  
Diamond Wire Sawing

scholarly journals Characterization of the Diamond Wire Sawing Process for Monocrystalline Silicon by Raman Spectroscopy and SIREX Polarimetry

Energies ◽  
2017 ◽  
Vol 10 (4) ◽  
pp. 414 ◽  
Author(s):  
Sindy Würzner ◽  
Martin Herms ◽  
Thomas Kaden ◽  
Hans Möller ◽  
Matthias Wagner
Keyword(s):  
Raman Spectroscopy ◽  
Monocrystalline Silicon ◽  
Diamond Wire ◽  
Diamond Wire Sawing ◽  
Sawing Process

scholarly journals Simulation of the ductile machining mode of silicon

2021 ◽  
Author(s):  
Hagen Klippel ◽  
Stefan Süssmaier ◽  
Matthias Röthlin ◽  
Mohamadreza Afrasiabi ◽  
Uygar Pala ◽  
...  
Keyword(s):  
Brittle Material ◽  
Material Removal ◽  
Machining Process ◽  
Ductile Material ◽  
Diamond Wire ◽  
Ductile Machining ◽  
Mesh Free ◽  
Diamond Wire Sawing ◽  
Material Removal Mode ◽  
Brittle Material Removal

AbstractDiamond wire sawing has been developed to reduce the cutting loss when cutting silicon wafers from ingots. The surface of silicon solar cells must be flawless in order to achieve the highest possible efficiency. However, the surface is damaged during sawing. The extent of the damage depends primarily on the material removal mode. Under certain conditions, the generally brittle material can be machined in ductile mode, whereby considerably fewer cracks occur in the surface than with brittle material removal. In the presented paper, a numerical model is developed in order to support the optimisation of the machining process regarding the transition between ductile and brittle material removal. The simulations are performed with an GPU-accelerated in-house developed code using mesh-free methods which easily handle large deformations while classic methods like FEM would require intensive remeshing. The Johnson-Cook flow stress model is implemented and used to evaluate the applicability of a model for ductile material behaviour in the transition zone between ductile and brittle removal mode. The simulation results are compared with results obtained from single grain scratch experiments using a real, non-idealised grain geometry as present in the diamond wire sawing process.

Research on the capillary penetration mechanism of cutting fluid supplied by electrostatic spraying in diamond wire sawing

2021 ◽  
Vol 71 ◽  
pp. 212-223
Author(s):  
Chunyan Yao ◽  
Kaixiang Xu ◽  
Dongdong Chen ◽  
Hongbing Wang ◽  
Yunfeng Liu
Keyword(s):  
Cutting Fluid ◽  
Diamond Wire ◽  
Electrostatic Spraying ◽  
Penetration Mechanism ◽  
Diamond Wire Sawing

Photocatalytic H2 evolution by AgNP@PSi/SiNS composite derived from diamond-wire sawing silicon waste

2021 ◽  
pp. 111495
Author(s):  
Xiufeng Li ◽  
Guoqiang Lv ◽  
Wenhui Ma ◽  
Shaoyuan Li ◽  
Jia Yang ◽  
...  
Keyword(s):  
H2 Evolution ◽  
Diamond Wire ◽  
Diamond Wire Sawing ◽  
Photocatalytic H2 Evolution
Sign in / Sign up

Export Citation Format

Share Document