Study on the subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted diamond wire sawing

2021 ◽  
pp. 108077
Author(s):  
Yan Wang ◽  
Bocheng Zhao ◽  
Shengju Huang ◽  
Zhaofeng Qian
Keyword(s):  
Ultrasonic Vibration ◽  
Subsurface Damage ◽  
Monocrystalline Silicon ◽  
Diamond Wire ◽  
Damage Depth ◽  
Diamond Wire Sawing

scholarly journals Experimental Investigation of the Sawn Surface of Monocrystalline Silicon Cut by Endless Diamond Wire Sawing

2020 ◽  
Vol 23 (4) ◽  
Author(s):  
Erick Cardoso Costa ◽  
Caroline Piesanti dos Santos ◽  
Fabio Antonio Xavier ◽  
Walter Lindolfo Weingaertner
Keyword(s):  
Experimental Investigation ◽  
Monocrystalline Silicon ◽  
Diamond Wire ◽  
Diamond Wire Sawing

Evaluation of fixed abrasive diamond wire sawing induced subsurface damage of solar silicon wafers

2019 ◽  
Vol 273 ◽  
pp. 116267 ◽  
Author(s):  
Huapan Xiao ◽  
Hairong Wang ◽  
Na Yu ◽  
Rongguang Liang ◽  
Zhe Tong ◽  
...  
Keyword(s):  
Subsurface Damage ◽  
Silicon Wafers ◽  
Diamond Wire ◽  
Solar Silicon ◽  
Diamond Wire Sawing ◽  
Fixed Abrasive

The impact of subsurface damage on the fracture strength of diamond-wire-sawn monocrystalline silicon wafers

2018 ◽  
Vol 57 (8S3) ◽  
pp. 08RB08 ◽  
Author(s):  
Halubai Sekhar ◽  
Tetsuo Fukuda ◽  
Katsuto Tanahashi ◽  
Katsuhiko Shirasawa ◽  
Hidetaka Takato ◽  
...  
Keyword(s):  
Fracture Strength ◽  
Subsurface Damage ◽  
Silicon Wafers ◽  
Monocrystalline Silicon ◽  
Diamond Wire ◽  
The Impact

INFLUENCE OF DIAMOND WIRE SAWING PARAMETERS ON SUBSURFACE MICROCRACKS FORMATION IN MONOCRYSTALLINE SILICON WAFER

2019 ◽  
Author(s):  
Erick Cardoso Costa ◽  
Caroline Piesanti dos Santos ◽  
Fabio Antonio Xavier ◽  
Walter Lindolfo Weingaertner
Keyword(s):  
Silicon Wafer ◽  
Monocrystalline Silicon ◽  
Diamond Wire ◽  
Diamond Wire Sawing

Analytical prediction of subsurface microcrack damage depth in diamond wire sawing silicon crystal

2020 ◽  
Vol 112 ◽  
pp. 105015 ◽  
Author(s):  
Liyuan Wang ◽  
Yufei Gao ◽  
Xinying Li ◽  
Tianzhao Pu ◽  
Youkang Yin
Keyword(s):  
Silicon Crystal ◽  
Analytical Prediction ◽  
Diamond Wire ◽  
Damage Depth ◽  
Diamond Wire Sawing

Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring in-depth and the Lateral Distributions for Different Cutting Parameters

2015 ◽  
Vol 1770 ◽  
pp. 61-66 ◽  
Author(s):  
Bhushan Sopori ◽  
Srinivas Devayajanam ◽  
Prakash Basnyat ◽  
Rekha Schnepf ◽  
Santosh Sahoo ◽  
...  
Keyword(s):  
Minority Carrier Lifetime ◽  
Cutting Parameters ◽  
Surface Damage ◽  
Phase Changes ◽  
Thin Layers ◽  
Diamond Grit ◽  
Diamond Wire ◽  
Damage Depth ◽  
Diamond Wire Sawing ◽  
A New Technique

ABSTRACTThis paper describes the characteristics of damage, introduced under different conditions of diamond wire sawing, on the Si wafer surfaces. The damage occurs in the form of frozen-in dislocations, phase changes, and microcracks. The in-depth damage was determined by conventional ways such as TEM, SEM and angle-polishing/defect-etching, which only provide local information. We have also applied a new technique based on sequential measurement of the minority carrier lifetime after etching thin layers from the surfaces to determine average damage depth and its in-depth distribution. The lateral spatial damage variations, which seem to be mainly related to wire reciprocation process, were observed by photoluminescence and lifetime mapping. Our results show a strong correlation of damage depth on the diamond grit size and wire usage.

scholarly journals Characterization of the Diamond Wire Sawing Process for Monocrystalline Silicon by Raman Spectroscopy and SIREX Polarimetry

Energies ◽  
2017 ◽  
Vol 10 (4) ◽  
pp. 414 ◽  
Author(s):  
Sindy Würzner ◽  
Martin Herms ◽  
Thomas Kaden ◽  
Hans Möller ◽  
Matthias Wagner
Keyword(s):  
Raman Spectroscopy ◽  
Monocrystalline Silicon ◽  
Diamond Wire ◽  
Diamond Wire Sawing ◽  
Sawing Process
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