Non-planar interconnects in double-sided flexible Cu-PET substrates using a laser-assisted maskless microdeposition process: 3D finite element modeling and experimental analysis
2014 ◽
Vol 54
◽
pp. 117-127
◽
2010 ◽
Vol 49
(4)
◽
pp. 720-733
◽
1991 ◽
Vol 27
(6)
◽
pp. 5016-5018
◽
2009 ◽
Vol 47
(5-8)
◽
pp. 543-555
◽
2006 ◽
pp. 19-28
◽
Keyword(s):
2013 ◽
Vol 12
(4)
◽
pp. 443-498
◽
2016 ◽
Vol 19
(16)
◽
pp. 1772-1784
◽
Keyword(s):