A chemically robust and self-healing superhydrophobic polybenzoxazine coating without fluorocarbon resin modification: Fabrication and failure mechanism

2022 ◽  
Vol 163 ◽  
pp. 106630
Author(s):  
Xiangkang Cao ◽  
Jinglong Pan ◽  
Guangyi Cai ◽  
Song Xiao ◽  
Xiaoze Ma ◽  
...  
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


2020 ◽  
Vol 11 (41) ◽  
pp. 6549-6558
Author(s):  
Yohei Miwa ◽  
Mayu Yamada ◽  
Yu Shinke ◽  
Shoichi Kutsumizu

We designed a novel polyisoprene elastomer with high mechanical properties and autonomous self-healing capability at room temperature facilitated by the coexistence of dynamic ionic crosslinks and crystalline components that slowly reassembled.


1982 ◽  
Vol 118 (4) ◽  
pp. 267-272 ◽  
Author(s):  
E. Bonifazi
Keyword(s):  

1995 ◽  
Vol 131 (4) ◽  
pp. 459-461 ◽  
Author(s):  
R. Caputo
Keyword(s):  

2008 ◽  
Vol 11 (-1) ◽  
pp. 188-201 ◽  
Author(s):  
Piotr Bogacz ◽  
Jarosława Kaczmarek ◽  
Danuta Leśniewska

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