Integration of trench-isolated through-wafer interconnects with 2d capacitive micromachined ultrasonic transducer arrays
2007 ◽
Vol 138
(1)
◽
pp. 221-229
◽
Xuefeng Zhuang
◽
Arif S. Ergun
◽
Yongli Huang
◽
Ira O. Wygant
◽
Omer Oralkan
◽
...
O. Oralkan
◽
A.S. Ergun
◽
Ching-hsiang Cheng
◽
J.A. Johnson
◽
M. Karaman
◽
...
2002 ◽
Vol 40
(1-8)
◽
pp. 471-476
◽
Jeremy Johnson
◽
Ömer Oralkan
◽
Utkan Demirci
◽
Sanlı Ergun
◽
Mustafa Karaman
◽
...
O. Oralkan
◽
A.S. Ergun
◽
C.-H. Cheng
◽
J.A. Johnson
◽
M. Karaman
◽
...
2015 ◽
Vol 15
(9)
◽
pp. 5177-5184
◽
Ravindra Mukhiya
◽
Aditi
◽
K. Prabakar
◽
M. Raghuramaiah
◽
J. Jayapandian
◽
...
O. Oralkan
◽
X.C. Jin
◽
K. Kaviani
◽
A.S. Ergun
◽
F.L. Degertekin
◽
...
I.O. Wygant
◽
D.T. Yeh
◽
Xuefeng Zhuang
◽
S. Vaithilingam
◽
A. Nikoozadeh
◽
...
Xun Wu
◽
Jean Sanders
◽
Xiao Zhang
◽
F. Yalcin Yamaner
◽
Omer Oralkan
Erlend Leirset
◽
Arne Ronnekleiv
◽
Astrid Aksnes
Xun Wu
◽
Jean Sanders
◽
Xiao Zhang
◽
F. Yalcin Yamaner
◽
Omer Oralkan
Erlend Leirset
◽
Astrid Aksnes