Plasma surface modification of polyimide films by air glow discharge for copper metallization on microelectronic flex substrates
2006 ◽
Vol 200
(12-13)
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pp. 3775-3785
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2006 ◽
Vol 27
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pp. 2258-2264
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2006 ◽
Vol 20
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pp. 917-938
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1994 ◽
Vol 32
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pp. 1829-1837
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1994 ◽
Vol 32
(10)
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pp. 1839-1845
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2009 ◽
Vol 114
(6)
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pp. 3602-3611
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2009 ◽
Vol 20
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pp. 2541-2548
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