Durability issues and service lifetime prediction of electrochromic windows for buildings applications

1999 ◽  
Vol 56 (3-4) ◽  
pp. 419-436 ◽  
Author(s):  
A.W. Czanderna ◽  
D.K. Benson ◽  
G.J. Jorgensen ◽  
J.-G. Zhang ◽  
C.E. Tracy ◽  
...  
2019 ◽  
Vol 9 (4) ◽  
pp. 1105-1112 ◽  
Author(s):  
Ismail Kaaya ◽  
Michael Koehl ◽  
Amantin Panos Mehilli ◽  
Sidrach de Cardona Mariano ◽  
Karl Anders Weiss

2021 ◽  
Author(s):  
Qichao Jin ◽  
Wenhu Wang ◽  
Ruisong Jiang ◽  
lei Guo

Abstract The die undergoing severe loads which induces inevitably wear in the pressure forming process, and the wear of die arouses obsessions about the die’s service lifetime. In order to obtain the geometrical shape transformation caused by wear and predict the service lifetime for a pair of rollers in net-shape blade rolling process, this paper quantified the distributions and evolutions of the local wear over roller cavities based on the local contact load responses, and predicted the lifetime which related to wear by a mathematical models. Firstly, the net-shape blade rolling process and the local contact load responses were summarized. Then, an improved wear model was provided based on the Archard formula, and the impact factors of the model was standardized by a regression analysis experiment. The transient wear distributions and evolutions over the roller cavities were enumerated, and the wear distribution for one rolling cycle was calculated based on wear accumulation effect. Finally, a lifetime prediction model was proposed to predict the service lifetime of the rollers according to the wear accumulation effect, and an experimental verification was carried out to validate the model. The results showed that the wear model and lifetime prediction model can be used for investigating the wear and lifetime prediction of the roller cavities for the net-shape blade rolling process.


1989 ◽  
Author(s):  
M. G. Hutchins ◽  
P. R. Dolley ◽  
K. Gindele ◽  
M. Khol ◽  
U. Frei ◽  
...  

2021 ◽  
Vol 291 ◽  
pp. 125983
Author(s):  
Tingting Xie ◽  
Changbing Zhang ◽  
Tongtong Wang ◽  
Wenzhe Cao ◽  
Chunhe Shen ◽  
...  

Author(s):  
S.J. Splinter ◽  
J. Bruley ◽  
P.E. Batson ◽  
D.A. Smith ◽  
R. Rosenberg

It has long been known that the addition of Cu to Al interconnects improves the resistance to electromigration failure. It is generally accepted that this improvement is the result of Cu segregation to Al grain boundaries. The exact mechanism by which segregated Cu increases service lifetime is not understood, although it has been suggested that the formation of thin layers of θ-CuA12 (or some metastable substoichiometric precursor, θ’ or θ”) at the boundaries may be necessary. This paper reports measurements of the local electronic structure of Cu atoms segregated to Al grain boundaries using spatially resolved EELS in a UHV STEM. It is shown that segregated Cu exists in a chemical environment similar to that of Cu atoms in bulk θ-phase precipitates.Films of 100 nm thickness and nominal composition Al-2.5wt%Cu were deposited by sputtering from alloy targets onto NaCl substrates. The samples were solution heat treated at 748K for 30 min and aged at 523K for 4 h to promote equilibrium grain boundary segregation. EELS measurements were made using a Gatan 666 PEELS spectrometer interfaced to a VG HB501 STEM operating at 100 keV. The probe size was estimated to be 1 nm FWHM. Grain boundaries with the narrowest projected width were chosen for analysis. EDX measurements of Cu segregation were made using a VG HB603 STEM.


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