Alignment of Boron Nitride Nanotubes in Polymeric Composite Films for Thermal Conductivity Improvement

2010 ◽  
Vol 114 (10) ◽  
pp. 4340-4344 ◽  
Author(s):  
Takeshi Terao ◽  
Chunyi Zhi ◽  
Yoshio Bando ◽  
Masanori Mitome ◽  
Chengchun Tang ◽  
...  
2019 ◽  
Vol 54 (1) ◽  
pp. 3-11 ◽  
Author(s):  
Sumit Sharma ◽  
Prince Setia ◽  
Rakesh Chandra ◽  
Nitin Thakur

Heat dissipation is very essential for the efficient working of electronic devices. There is a widespread demand for high thermal conductivity materials. Boron nitride nanotubes have high thermal conductivity but due to their poor interfacial adhesion with polymers, their use as heat dissipating material is restricted. In this study, a silane-coupling agent has been used to modify the boron nitride nanotubes. These tubes were then inserted in polymethyl methacrylate matrix. Various properties such as thermal conductivity, storage modulus, and loss factor have been predicted. Molecular dynamics simulations have also been used for accurate prediction of the properties of boron nitride nanotubes/polymethyl methacrylate composites. The boron nitride nanotubes weight percentage was varied from 0% to 70% for studying the effect on thermal conductivity, storage modulus, and loss factor. The experimentally obtained thermal conductivity increased rapidly from 0.6 W/mK at 40 wt.% of boron nitride nanotubes to about 3.8 W/mK at 80 wt.% of boron nitride nanotubes in polymethyl methacrylate matrix (an increase of nearly 533%). A similar trend was obtained using molecular dynamics simulations. The storage modulus increased from 2 GPa (for pure polymethyl methacrylate) to about 5 GPa (for 70 wt.% boron nitride nanotubes). The glass transition temperature of boron nitride nanotubes/polymethyl methacrylate composites shifted to higher temperatures with an increase in boron nitride nanotubes weight percentage.


e-Polymers ◽  
2019 ◽  
Vol 19 (1) ◽  
pp. 70-78 ◽  
Author(s):  
Renbo Wei ◽  
Qian Xiao ◽  
Chenhao Zhan ◽  
Yong You ◽  
Xuefei Zhou ◽  
...  

AbstractBoron nitride (BN) coated with sulfonated poly-arylene ether nitrile (SPEN) (BN@SPEN) was used as additive to enhance the thermal conductivity of polyarylene ether nitrile. BN@SPEN was prepared by coating BN micro-platelets with SPEN through ultrasonic technology combined with the post-treatment bonding process. The prepared BN@SPEN was characterized by FTIR, TGA, SEM and TEM, which confirmed the successful coating of BN micro-platelets. The obtained BN@SPEN was introduced into the PEN matrix to prepare composite films by a solution casting method. The compatibility between BN and PEN matrix was studied by using SEM observation and rheology measurement. Furthermore, thermal conductivity of BN@SPEN/PEN films were carefully characterized. Thermal conductivity of BN@SPEN/PEN films was increased to 0.69 W/(m⋅K) at 20 wt% content of BN@SPEN, having 138% increment comparing with pure PEN.


2018 ◽  
Vol 160 ◽  
pp. 199-207 ◽  
Author(s):  
Cuiping Yu ◽  
Wenbin Gong ◽  
Wei Tian ◽  
Qichong Zhang ◽  
Yancui Xu ◽  
...  

ACS Nano ◽  
2017 ◽  
Vol 11 (5) ◽  
pp. 5167-5178 ◽  
Author(s):  
Xiaoliang Zeng ◽  
Jiajia Sun ◽  
Yimin Yao ◽  
Rong Sun ◽  
Jian-Bin Xu ◽  
...  

RSC Advances ◽  
2018 ◽  
Vol 8 (8) ◽  
pp. 4426-4433 ◽  
Author(s):  
Dukeun Kim ◽  
Sumin Ha ◽  
Hoi Kil Choi ◽  
Jaesang Yu ◽  
Yoong Ahm Kim

The interfacial effect between an organic matrix and inorganic nanofillers on the thermal conductivity of a polymer composite was systematically explored by assembling amine-functionalized boron nitride nanotubes onto an electrospun nanofiber.


2016 ◽  
Vol 9 (7) ◽  
pp. 075002 ◽  
Author(s):  
Boubakeur Essedik Belkerk ◽  
Amine Achour ◽  
Dongyan Zhang ◽  
Salah Sahli ◽  
M-Abdou Djouadi ◽  
...  

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