Using an embedded Buckypaper to monitor mode I crack growth in bonded joints

2020 ◽  
pp. 1-19
Author(s):  
Idoia Gaztelumendi ◽  
H. Villaverde ◽  
B. Pérez ◽  
M. Chapartegui ◽  
S. Flórez ◽  
...  
2020 ◽  
Vol 224 ◽  
pp. 106778 ◽  
Author(s):  
J. Manterola ◽  
M. Aguirre ◽  
J. Zurbitu ◽  
J. Renart ◽  
A. Turon ◽  
...  

2004 ◽  
Vol 53 (8) ◽  
pp. 894-899 ◽  
Author(s):  
Kazushi SATO ◽  
Toshiyuki HASHIDA
Keyword(s):  
Mode I ◽  

2006 ◽  
Vol 54 (19) ◽  
pp. 5115-5122 ◽  
Author(s):  
Yasuhide Shindo ◽  
Fumio Narita ◽  
Katsumi Horiguchi ◽  
Tetsu Komatsu

2008 ◽  
Vol 75 (18) ◽  
pp. 5122-5133 ◽  
Author(s):  
G.V. Marannano ◽  
L. Mistretta ◽  
A. Cirello ◽  
S. Pasta

2012 ◽  
Vol 591-593 ◽  
pp. 2028-2031
Author(s):  
Chang Zheng Chen ◽  
Yu Zhang ◽  
Bo Zhou ◽  
Shi Wei Zhang

The relationship between stress and crack growth was studied. Applying the software ANSYS, the method of calculating stress intensity factor of composite mode cracks was built. At the same time, the stress intensity factor of mode I crack was calculated and the influence of crack size and loading on the stress intensity factor was studied. The results show that the results of ANSYS are almost the same to analytic results, which proves that the method is feasible. When the crack is quite big or quite small, the result of ANSYS’ error is comparatively obvious, which is due to the problem of the refinement of meshing. When the crack is too big, the dense of meshing is inadequate.


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