Cooling of Laser Slab by Forced Convection through a Heat Sink

2007 ◽  
Vol 28 (11) ◽  
pp. 931-939 ◽  
Author(s):  
Jingchun Min ◽  
Junrong Wang ◽  
Yaozu Song
Keyword(s):  
Forced Convection ◽  
Heat Sink

Analysis of a diamond heat spreader in a forced convection finned heat sink

2000 ◽  
Author(s):  
Brian Leonhardt ◽  
Aaron Webb ◽  
W. Bowman
Keyword(s):  
Forced Convection ◽  
Heat Sink ◽  
Heat Spreader

A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks

1990 ◽  
Vol 112 (3) ◽  
pp. 234-240 ◽  
Author(s):  
G. L. Lehmann ◽  
S. J. Kosteva
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Heat Sink ◽  
Convection Heat Transfer ◽  
Heat Sinks ◽  
Air Cooling ◽  
Transfer Coefficients ◽  
Packaging System ◽  
Transfer Rates ◽  
Heat Transfer Coefficients

An experimental study of forced convection heat transfer is reported. Direct air cooling of an electronics packaging system is modeled by a channel flow, with an array of uniformly sized and spaced elements attached to one channel wall. The presence of a single or complete row of longitudinally finned heat sinks creates a modified flow pattern. Convective heat transfer rates at downstream positions are measured and compared to that of a plain array (no heat sinks). Heat transfer rates are described in terms of adiabatic heat transfer coefficients and thermal wake functions. Empirical correlations are presented for both variations in Reynolds number (5000 < Re < 20,000) and heat sink geometry. It is found that the presence of a heat sink can both enhance and degrade the heat transfer coefficient at downstream locations, depending on the relative position.

Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules

2013 ◽  
Vol 136 (1) ◽  
Author(s):  
Kyoung Joon Kim
Keyword(s):  
Forced Convection ◽  
Thermal Performance ◽  
Heat Sink ◽  
Light Emitting Diode ◽  
Internal Flow ◽  
Thermal Control ◽  
Numerical Prediction ◽  
Light Emitting ◽  
Convection Condition ◽  
Pin Fins

In this paper we introduce a hybrid fin heat sink (HFH) proposed for the thermal control of light emitting diode (LED) lighting modules. The HFH consists of the array of hybrid fins which are hollow pin fins having internal channels and integrated with plate fins. The thermal performance of the HFH under either natural or forced convection condition is both experimentally and numerically investigated, and then its performance is compared with that of a pin fin heat sink (PFH). The observed maximum discrepancies of the numerical prediction to the measurement for the HFH are 7% and 6% for natural and forced convection conditions. The reasonable discrepancies demonstrate the tight correlation between the numerical prediction and the measurement. The thermal performance of the HFH is found to be 12–14% better than the PFH for the natural convection condition. The better performance might be explained by the enlarged external surface and the internal flow via the channel of the HF. The reference HFH is about 14% lighter than the reference PFH. The better thermal performance and the lighter weight of the HFH show the feasibility as the promising heat sink especially for the thermal control of LED street and flood lighting modules.

Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 1 — Modification of Heat Sink Assembly

2013 ◽  
Author(s):  
Saeed Ghalambor ◽  
John Edward Fernandes ◽  
Dereje Agonafer ◽  
Veerendra Mulay
Keyword(s):  
Pressure Distribution ◽  
Forced Convection ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Thermal Interface Material ◽  
Air Cooling ◽  
Interfacial Pressure ◽  
Interfacial Contact ◽  
Torque Analysis

Forced convection air cooling using heat sinks is one of the most prevalent methods in thermal management of microelectronic devices. Improving the performance of such a solution may involve minimizing the external thermal resistance (Rext) of the package. For a given heat sink design, this can be achieved by reducing the thermal interface material (TIM) thickness through promotion of a uniform interfacial pressure distribution between the device and heat sink. In this study, a dual-CPU rackmount server is considered and modifications to the heat sink assembly such as backplate thickness and bolting configuration are investigated to achieve the aforementioned improvements. A full-scale, simplified model of the motherboard is deployed in ANSYS Mechanical, with emphasis on non-linear contact analysis and torque analysis of spring screws, to determine the optimal design of the heat sink assembly. It is observed that improved interfacial contact and pressure distribution is achieved by increasing the number of screws (loading points) and positioning them as close to the contact area as possible. The numerical model is validated by comparison with experimental measurements within reasonable accuracy. Based on the results of numerical analysis, the heat sink assembly is modified and improvement over the base configuration is experimentally quantified through interfacial pressure measurement. The effect of improved interfacial contact on thermal performance of the solution is discussed.

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