Spinodal decomposition and interface dynamics for Glauber evolution with Kac potential

Author(s):  
A DeMasi
2020 ◽  
Author(s):  
Dork Sahagian ◽  
Tamara Carley ◽  
Anja Allabar ◽  
James Gardner ◽  
Ed Lewellin ◽  
...  

1986 ◽  
Vol 47 (C2) ◽  
pp. C2-259-C2-264 ◽  
Author(s):  
R. GRÜNE ◽  
P. HAASEN

1999 ◽  
Vol 115 (6) ◽  
pp. 475-480
Author(s):  
Tatsuo YAMAGUCHI ◽  
Toshiaki NAKAI ◽  
Naoya ASANUMA ◽  
Sachiko ONO ◽  
Kunihiko TAKEDA

Author(s):  
Zhiheng Huang ◽  
Zhiyong Wu ◽  
Hua Xiong ◽  
Yucheng Ma

Abstract Microstructure and its effect on mechanical behavior of ultrafine interconnects have been studied in this paper using a modeling approach. The microstructure from the processes of solidification, spinodal decomposition, and grain growth in ultrafine interconnects has highlighted its importance. The size, geometry and composition of interconnects as well as the elastic energy can influence microstructure and thus the mechanical behavior. Quantification of microstructure in ultrafine interconnects is a necessary step to establish the linkage between microstructure and reliability.


1997 ◽  
Vol 7 (10) ◽  
pp. 1191-1200 ◽  
Author(s):  
Juan M. López ◽  
Miguel A. Rodríguez

1997 ◽  
Vol 26 (2) ◽  
pp. 319-322 ◽  
Author(s):  
Anna Hillbricht-Ilkowska ◽  
Iwona Jasser ◽  
Iwona Kostrzewska-Szlakowska

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