A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature
2020 ◽
Vol 8
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pp. 122898-122907
Jiaxing Hu
◽
Bo Jing
◽
Yifeng Huang
◽
Xiaoxuan Jiao
◽
Meng Sun
◽
...
2006 ◽
Vol 95
(5)
◽
pp. 517-518
◽
Upendra M. Sainju
◽
Daniel Liptzin
◽
Sadikshya M. Dangi
2021 ◽
pp. 002076402199280
Hans Oh
◽
Jordan E DeVylder
◽
Ai Koyanagi
Dingliang Chen
◽
Yi Qin
◽
Yi Wang
◽
Jianghong Zhou
2022 ◽
Vol 162
◽
pp. 108053
Tongtong Yan
◽
Dong Wang
◽
Meimei Zheng
◽
Tangbin Xia
◽
Ershun Pan
◽
...
2019 ◽
Vol 32
(2)
◽
pp. 409-416
◽
Jianzhong SUN
◽
Chaoyi LI
◽
Cui LIU
◽
Ziwei GONG
◽
Ronghui WANG
1995 ◽
Vol 13
(1)
◽
pp. 21-25
◽
Niels Bentzen
◽
Terkel Christiansen
1997 ◽
Vol 97
(1-2)
◽
pp. 193
A.I. Goren
◽
S. Hellmann
◽
E.D. Glaser
2021 ◽
Vol 42
◽
pp. 103072
Wenjie Pan
◽
Xuesong Luo
◽
Maotao Zhu
◽
Jia Ye
◽
Lihong Gong
◽
...
Byungyoung Oh
◽
Seog-Ju Cha
◽
Sungsoo Na
◽
Liviu Librescu