scholarly journals A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature

IEEE Access ◽  
2020 ◽  
Vol 8 ◽  
pp. 122898-122907
Author(s):  
Jiaxing Hu ◽  
Bo Jing ◽  
Yifeng Huang ◽  
Xiaoxuan Jiao ◽  
Meng Sun ◽  
...  
2021 ◽  
Vol 42 ◽  
pp. 103072
Author(s):  
Wenjie Pan ◽  
Xuesong Luo ◽  
Maotao Zhu ◽  
Jia Ye ◽  
Lihong Gong ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document