Thermal induced warpage characterization for printed circuit boards with shadow moire system

Author(s):  
Ming Ying ◽  
Yew Chia ◽  
Arman Mohtar ◽  
Tiang Yin ◽  
Sai Chuah
2021 ◽  
Author(s):  
Sim Jui Oon ◽  
Khai Shiang Tan ◽  
Teck Yong Tou ◽  
Seong Shan Yap ◽  
Chun Sean Lau ◽  
...  

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara

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