2006 8th Electronics Packaging Technology Conference
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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Exploring the ulthimo platform

2006 ◽  
Author(s):  
Marc de Samber ◽  
Coen Tak ◽  
Wil Peels

Mechanical characterization of microelectronics embedded in flexible and stretchable substrate

2006 ◽  
Author(s):  
L. Wang ◽  
T. Zoumpoulidis ◽  
M. Bartek ◽  
A. Polyakov ◽  
K.M.B. Jansen ◽  
...  
Keyword(s):  
Mechanical Characterization

Reliability analysis of sandwich microdisplay packaging using an integrated interferometry system

2006 ◽  
Author(s):  
Audrey C.Y. Wong ◽  
Yaofeng Sun ◽  
Sow Chorng ◽  
Su Fei ◽  
John H.L. Pang
Keyword(s):  
Reliability Analysis

Improvement of mechanical impact resistance of BGA packages with Pb-free solder bumps

2006 ◽  
Author(s):  
X.J. Zhao ◽  
J.F.J.M. Caers ◽  
J.W.C. de Vries ◽  
J. Kloosterman ◽  
E.H. Wong ◽  
...  
Keyword(s):  
Impact Resistance ◽  
Mechanical Impact ◽  
Bga Packages ◽  
Solder Bumps ◽  
Free Solder
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