2008 International Conference on Electronic Packaging Technology & High Density Packaging

Mapping Intimacies ◽

10.1109/icept-hdp14648.2008 ◽

2008 ◽

Keyword(s):

Electronic Packaging ◽

High Density ◽

Packaging Technology ◽

International Conference ◽

High Density Packaging

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2010 11th International Conference on Electronic Packaging Technology & High Density Packaging

10.1109/icept-hdp17554.2010 ◽

2010 ◽

Keyword(s):

Electronic Packaging ◽

High Density ◽

Packaging Technology ◽

International Conference ◽

High Density Packaging

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2009 International Conference on Electronic Packaging Technology & High Density Packaging

10.1109/icept-hdp15675.2009 ◽

2009 ◽

Keyword(s):

Electronic Packaging ◽

High Density ◽

Packaging Technology ◽

International Conference ◽

High Density Packaging

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2012 13th International Conference on Electronic Packaging Technology & High Density Packaging

10.1109/icept-hdp20818.2012 ◽

2012 ◽

Keyword(s):

Electronic Packaging ◽

High Density ◽

Packaging Technology ◽

International Conference ◽

High Density Packaging

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2011 12th International Conference on Electronic Packaging Technology and High Density Packaging

10.1109/icept-hdp19752.2011 ◽

2011 ◽

Keyword(s):

Electronic Packaging ◽

High Density ◽

Packaging Technology ◽

International Conference ◽

High Density Packaging

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Proceedings, 2008 international conference on electronic packaging technology & high density packaging (ICEPT-HDP 2008)

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4606931 ◽

2008 ◽

Keyword(s):

Electronic Packaging ◽

High Density ◽

Packaging Technology ◽

International Conference ◽

High Density Packaging

Download Full-text

Special Articles: The Micro Soldering Technology of Super High Density Packaging. Chip-size Packaging Technology.

Circuit Technology ◽

10.5104/jiep1986.9.475 ◽

1994 ◽

Vol 9 (7) ◽

pp. 475-478

Author(s):

Sugio UCHIDA ◽

Shinichi WAKABAYASHI

Keyword(s):

High Density ◽

Packaging Technology ◽

Chip Size ◽

Soldering Technology ◽

High Density Packaging

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High-density packaging technology solution for Smart ICT

2016 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.1109/panpacific.2016.7428399 ◽

2016 ◽

Author(s):

Koukou Suu

Keyword(s):

High Density ◽

Packaging Technology ◽

Technology Solution ◽

High Density Packaging

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2016 17th International Conference on Electronic Packaging Technology (ICEPT)

10.1109/icept38827.2016 ◽

2016 ◽

Keyword(s):

Electronic Packaging ◽

Packaging Technology ◽

International Conference

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2015 16th International Conference on Electronic Packaging Technology (ICEPT)

10.1109/icept36319.2015 ◽

2015 ◽

Keyword(s):

Electronic Packaging ◽

Packaging Technology ◽

International Conference

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2013 14th International Conference on Electronic Packaging Technology

10.1109/icept31628.2013 ◽

2013 ◽

Keyword(s):

Electronic Packaging ◽

Packaging Technology ◽

International Conference

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