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Published By Japan Institute Of Electronics Packaging

1884-118x, 0914-8299
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scholarly journals Factors Affecting Properties of Electrolessly Deposited Copper.

1994 ◽  
Vol 9 (1) ◽  
pp. 31-36
Author(s):  
Hideo HONMA ◽  
Ken HAGIWARA ◽  
Takeshi KOBAYASHI
Keyword(s):  
Factors Affecting

scholarly journals Mechanism of Nodule Formation in Electroless Copper Deposition.

1994 ◽  
Vol 9 (2) ◽  
pp. 112-118 ◽  
Author(s):  
Takeyuki ITABASHI ◽  
Haruo AKAHOSHI ◽  
Akio TAKAHASHI
Keyword(s):  
Copper Deposition ◽  
Nodule Formation ◽  
Electroless Copper

scholarly journals Effects of P Content of Electroless Ni-P under Layer on Displacement Au Films.

1994 ◽  
Vol 9 (2) ◽  
pp. 99-103 ◽  
Author(s):  
Junichi KATAYAMA ◽  
Yutaka NAKAGISI ◽  
Kuniaki OTSUKA ◽  
Masanobu IZAKI
Keyword(s):  
P Content ◽  
Electroless Ni
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