High-density packaging technology solution for Smart ICT

2016 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.1109/panpacific.2016.7428399 ◽

2016 ◽

Author(s):

Koukou Suu

Keyword(s):

High Density ◽

Packaging Technology ◽

Technology Solution ◽

High Density Packaging

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Special Articles: The Micro Soldering Technology of Super High Density Packaging. Chip-size Packaging Technology.

Circuit Technology ◽

10.5104/jiep1986.9.475 ◽

1994 ◽

Vol 9 (7) ◽

pp. 475-478

Author(s):

Sugio UCHIDA ◽

Shinichi WAKABAYASHI

Keyword(s):

High Density ◽

Packaging Technology ◽

Chip Size ◽

Soldering Technology ◽

High Density Packaging

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Trends in High Density Packaging Technologies(4). Packaging Technology for TFT-LCD Module, Trend and Outlook.

Journal of The Japan Institute of Electronics Packaging ◽

10.5104/jiep.1.509 ◽

1998 ◽

Vol 1 (6) ◽

pp. 509-514

Author(s):

Hideyuki NISHIDA ◽

Kazunori SAKAMOTO

Keyword(s):

High Density ◽

Packaging Technology ◽

High Density Packaging

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Trends in High Density Packaging Technologies. Consideration of Packaging Technology for System LSI.

Journal of The Japan Institute of Electronics Packaging ◽

10.5104/jiep.2.566 ◽

1999 ◽

Vol 2 (7) ◽

pp. 566-570

Author(s):

Fumio MIYAGAWA ◽

Shoji KOIZUMI ◽

Takayoshi HANABUSA

Keyword(s):

High Density ◽

Packaging Technology ◽

High Density Packaging

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2010 11th International Conference on Electronic Packaging Technology & High Density Packaging

10.1109/icept-hdp17554.2010 ◽

2010 ◽

Keyword(s):

Electronic Packaging ◽

High Density ◽

Packaging Technology ◽

International Conference ◽

High Density Packaging

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2009 International Conference on Electronic Packaging Technology & High Density Packaging

10.1109/icept-hdp15675.2009 ◽

2009 ◽

Keyword(s):

Electronic Packaging ◽

High Density ◽

Packaging Technology ◽

International Conference ◽

High Density Packaging

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High density packaging technology ultra thin package & new tab package

Journal of Electronic Materials ◽

10.1007/bf02657479 ◽

1989 ◽

Vol 18 (5) ◽

pp. 633-643 ◽

Author(s):

Osamu Nakagawa ◽

Haruo Shimamoto ◽

Tetsuya Ueda ◽

Kou Shimomura ◽

Tsutomu Hata ◽

...

Keyword(s):

High Density ◽

Packaging Technology ◽

High Density Packaging

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High density packaging technology

Microelectronics Journal ◽

10.1016/s0026-2692(84)80144-5 ◽

1984 ◽

Vol 15 (3) ◽

pp. 38

Keyword(s):

High Density ◽

Packaging Technology ◽

High Density Packaging

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2012 13th International Conference on Electronic Packaging Technology & High Density Packaging

10.1109/icept-hdp20818.2012 ◽

2012 ◽

Keyword(s):

Electronic Packaging ◽

High Density ◽

Packaging Technology ◽

International Conference ◽

High Density Packaging

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2011 12th International Conference on Electronic Packaging Technology and High Density Packaging

10.1109/icept-hdp19752.2011 ◽

2011 ◽

Keyword(s):

Electronic Packaging ◽

High Density ◽

Packaging Technology ◽

International Conference ◽

High Density Packaging

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2008 International Conference on Electronic Packaging Technology & High Density Packaging

10.1109/icept-hdp14648.2008 ◽

2008 ◽

Keyword(s):

Electronic Packaging ◽

High Density ◽

Packaging Technology ◽

International Conference ◽

High Density Packaging

Download Full-text