Study of the junction to case thermal resistance test method for IC based on ETM

Author(s):  
Zhang Hongshuo ◽  
Zhao Yuanfu ◽  
Yao Quanbin ◽  
Cao Yusheng
2020 ◽  
Vol 15 ◽  
pp. 155892501990083
Author(s):  
Xintong Li ◽  
Honglian Cong ◽  
Zhe Gao ◽  
Zhijia Dong

In this article, thermal resistance test and water vapor resistance test were experimented to obtain data of heat and humidity performance. Canonical correlation analysis was used on determining influence of basic fabric parameters on heat and humidity performance. Thermal resistance model and water vapor resistance model were established with a three-layered feedforward-type neural network. For the generalization of the network and the difficulty of determining the optimal network structure, trainbr was chosen as training algorithm to find the relationship between input factors and output data. After training and verification, the number of hidden layer neurons in the thermal resistance model was 12, and the error reached 10−3. In the water vapor resistance model, the number of hidden layer neurons was 10, and the error reached 10−3.


1968 ◽  
Vol EI-3 (1) ◽  
pp. 18-23
Author(s):  
Y. Saito ◽  
Taro Hino ◽  
M. Suzuki
Keyword(s):  

Sign in / Sign up

Export Citation Format

Share Document