2013 14th International Conference on Electronic Packaging Technology
Latest Publications

TOTAL DOCUMENTS

295

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H-INDEX

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Published By IEEE

9781479904983

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Finite element based DOE methodology for thermal fatigue reliability design of multi-row QFN packages

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756523 ◽

2013 ◽

Author(s):

Xia Guofeng ◽

Qin Fei ◽

Gao Cha ◽

An Tong ◽

Zhu Wenhui

Keyword(s):

Finite Element ◽

Thermal Fatigue ◽

Fatigue Reliability ◽

Reliability Design

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The interfacial microstructure and Kirkendall voids in In-48Sn/Cu solder joint

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756608 ◽

2013 ◽

Cited By ~ 1

Author(s):

Fei-fei Tian ◽

Zhi-quan Liu

Keyword(s):

Solder Joint ◽

Interfacial Microstructure ◽

Kirkendall Voids

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Non-destructive testing for defects in electronic package based on Infrared Thermography

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756600 ◽

2013 ◽

Cited By ~ 5

Author(s):

Liu Chengyan ◽

Qin Fei ◽

Ban Zhaowei

Keyword(s):

Infrared Thermography ◽

Non Destructive Testing ◽

Destructive Testing ◽

Electronic Package ◽

Non Destructive

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Warpage characteristics of wafer-level package of MEMS with glass frit bonding

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756603 ◽

2013 ◽

Cited By ~ 1

Author(s):

Gaowei Xu ◽

Shuangfu Wang ◽

Chunsheng Zhu ◽

Jiaotuo Ye ◽

Wei Gai ◽

...

Keyword(s):

Glass Frit ◽

Wafer Level ◽

Wafer Level Package

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Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0.5Cu/Cu solder joints

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756579 ◽

2013 ◽

Author(s):

Hailong Li ◽

Mingliang Fu ◽

Mei Zhu ◽

Rong An ◽

Chunqing Wang ◽

...

Keyword(s):

High Temperature ◽

Microstructural Evolution ◽

Thermal Aging ◽

Solder Joints

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Simulation of 63Sn-37Pb BGA packaging particle formation based on pulsated orifice ejection method (POEM)

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756484 ◽

2013 ◽

Author(s):

L. Zhao ◽

F. M. Xu ◽

D. Lu ◽

W. Dong ◽

Y. Li ◽

...

Keyword(s):

Particle Formation ◽

Ejection Method

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Flip chip assembly with advanced RDL technology

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756421 ◽

2013 ◽

Cited By ~ 1

Author(s):

Shengmin Wen ◽

KyungRok Park ◽

Patrick Thompson ◽

Dwayne Shirley ◽

JeongSeok Lee ◽

...

Keyword(s):

Flip Chip ◽

Flip Chip Assembly

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Effect of chemical functionalization of multi-walled carbon nanotubes with 4'-Allyloxy-biphenyl-4-ol on thermal and mechanical properties of organosilicon nanocomposites

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756460 ◽

2013 ◽

Author(s):

Xue Gao ◽

Dayong Gui ◽

Jianhong Liu

Keyword(s):

Mechanical Properties ◽

Carbon Nanotubes ◽

Thermal And Mechanical Properties ◽

Chemical Functionalization ◽

Multi Walled Carbon Nanotubes ◽

Walled Carbon Nanotubes

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Improvement of microstructure and mechanical properties of Sn-58Bi alloy with La2O3

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756451 ◽

2013 ◽

Cited By ~ 1

Author(s):

Lijiao Gao ◽

Jun Wang ◽

Tiesong Lin ◽

Peng He ◽

Fengjiao Lu

Keyword(s):

Mechanical Properties ◽

Microstructure And Mechanical Properties

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Effect of wetting agent on the properties of thermal grease with Al based fillers

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756477 ◽

2013 ◽

Author(s):

Ling Zhang ◽

Zhi Zhang ◽

Pengli Zhu ◽

Kai Zhang ◽

Xianzhu Fu ◽

...

Keyword(s):

Wetting Agent ◽

Thermal Grease

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2013 14th International Conference on Electronic Packaging TechnologyLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Finite element based DOE methodology for thermal fatigue reliability design of multi-row QFN packages

The interfacial microstructure and Kirkendall voids in In-48Sn/Cu solder joint

Non-destructive testing for defects in electronic package based on Infrared Thermography

Warpage characteristics of wafer-level package of MEMS with glass frit bonding

Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0.5Cu/Cu solder joints

Simulation of 63Sn-37Pb BGA packaging particle formation based on pulsated orifice ejection method (POEM)

Flip chip assembly with advanced RDL technology

Effect of chemical functionalization of multi-walled carbon nanotubes with 4'-Allyloxy-biphenyl-4-ol on thermal and mechanical properties of organosilicon nanocomposites

Improvement of microstructure and mechanical properties of Sn-58Bi alloy with La2O3

Effect of wetting agent on the properties of thermal grease with Al based fillers

2013 14th International Conference on Electronic Packaging Technology
Latest Publications