HEATSMART: An interactive application aware thermal management framework for MPSoC embedded systems

Author(s):  
Jude Angelo Ambrose
2020 ◽  
Vol 69 (6) ◽  
pp. 894-906 ◽  
Author(s):  
Young Geun Kim ◽  
Minyong Kim ◽  
Joonho Kong ◽  
Sung Woo Chung

2021 ◽  
Author(s):  
Mohsen Ansari ◽  
Sina Yari-Karin ◽  
Sepideh Safari ◽  
Alireza Ejlali

Thermal Design Power (TDP) as the chip-level power constraint for a specific chip has been exploited in fault-tolerant embedded systems. TDP, as the chip-level power constraint of the system, could be either pessimistic or thermally unsafe. Employing TDP as a pessimistic constraint can increase the rate of missing real-time constraints because of triggering Dynamic Thermal Management (DTM) more frequently. If TDP as a chip-level power constraint is not a pessimistic constraint, TDP can be thermally unsafe and can lead to thermal violations. Employing Thermal Safe Power (TSP) as the core-level power constraint, which is defined as a function of the number of simultaneously operating cores, can result in improving the efficiency and the schedulability. This comment improves the efficiency and the schedulability rate of one of the proposed methods in the literature by employing TSP.


2008 ◽  
Vol 2008 (1) ◽  
pp. 250895 ◽  
Author(s):  
Nishanth Shankaran ◽  
Nilabja Roy ◽  
DouglasC Schmidt ◽  
XenofonD Koutsoukos ◽  
Yingming Chen ◽  
...  

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