Life-cycle impacts of lead and lead-free solder used in wave soldering of electronics

2005 ◽  
Author(s):  
M.L. Socolof ◽  
J.R. Geibig
Keyword(s):  
Life Cycle ◽  
Lead Free ◽  
Lead Free Solder ◽  
Wave Soldering ◽  
Free Solder

Tin (Sn) Recovery from Wave Soldering Lead Free Solder Dross via Hydrochloric Acid Leaching and Combustion Treatment

2016 ◽  
Vol 857 ◽  
pp. 535-539 ◽  
Author(s):  
Syarifah Aminah Ismail ◽  
Noorina Hidayu Jamil ◽  
Kamarudin Hussin ◽  
Mohd Arif Anuar Mohd Salleh
Keyword(s):  
Hydrochloric Acid ◽  
Thermal Treatment ◽  
Optimum Parameter ◽  
Heating Temperature ◽  
Acid Leaching ◽  
Lead Free ◽  
Lead Free Solder ◽  
Wave Soldering ◽  
Hydrochloric Acid Leaching ◽  
Free Solder

The pyrometallurgical method of tin extraction from lead free solder dross after leaching treatment is discussed. The solder dross is sieved into 75 μm was used for the experiment. The samples were leached using 0.3 M HCl, 12 hours stirring times and temperature of 60°C was used for the leaching before thermal treatment. The sample was thermally treated at temperature of 650,850 and 1050°C. The increase of heating temperature causes the lowering of the tin extraction. The optimum parameter for heating temperature is 850°C with 98.71% of tin recovery.

Protection against lead-free solder in wave-soldering by Ti/TiC coatings prepared by filtered cathodic arc deposition

2017 ◽  
Vol 312 ◽  
pp. 7-12 ◽  
Author(s):  
Shu Xiao ◽  
Zhongzhen Wu ◽  
Liangliang Liu ◽  
Ricky K.Y. Fu ◽  
Wan Li ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Wave Soldering ◽  
Cathodic Arc Deposition ◽  
Free Solder ◽  
Cathodic Arc ◽  
Arc Deposition

Lead-free Solder Joints Strength for Wave Soldering after Reflow Soldering

2003 ◽  
Vol 2003 (0) ◽  
pp. 621-622
Author(s):  
Hiroyuki TAKAHASHI ◽  
Kenji HIROHATA ◽  
Katsumi HISANO ◽  
Takashi KAWAKAMI ◽  
Naoyuki OZAWA ◽  
...  
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Soldering ◽  
Wave Soldering ◽  
Free Solder
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