Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.
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80 plus: a strategy for reducing the inherent environmental impacts of computers

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. ◽

10.1109/isee.2005.1437012 ◽

2005 ◽

Cited By ~ 5

Author(s):

C. Calwell ◽

P. Ostendorp

Keyword(s):

Environmental Impacts

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New microprocessor features for lower power and increased performance: doing "Moore's" with less

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. ◽

10.1109/isee.2005.1437011 ◽

2005 ◽

Cited By ~ 1

Author(s):

D. Sadowy

Keyword(s):

Lower Power

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Case study for high volume lead-free wave soldering process with environmental benefits

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. ◽

10.1109/isee.2005.1437002 ◽

2005 ◽

Cited By ~ 2

Author(s):

I. Baylakoglu ◽

S. Hamarat ◽

H. Gokmen ◽

E. Meric

Keyword(s):

High Volume ◽

Environmental Benefits ◽

Lead Free ◽

Free Wave ◽

Soldering Process ◽

Wave Soldering

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Packaging in the IT environment - competing challenges in the design of packaging for electronic products

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. ◽

10.1109/isee.2005.1437000 ◽

2005 ◽

Author(s):

J. Horbal ◽

M. Schaffer

Keyword(s):

Electronic Products

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Intelligent disassembly sequence planning for EOL recycling based on hierarchical fuzzy cognitive map

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. ◽

10.1109/isee.2005.1437038 ◽

2005 ◽

Cited By ~ 2

Author(s):

Pan Xiaoyong ◽

Duan Guanghong ◽

Xiang Dong ◽

Mou Peng

Keyword(s):

Cognitive Map ◽

Fuzzy Cognitive Map ◽

Disassembly Sequence Planning ◽

Sequence Planning ◽

Disassembly Sequence

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Analyzing and modeling of uncertainty factors influencing product recyclability

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. ◽

10.1109/isee.2005.1436986 ◽

2005 ◽

Author(s):

Qi Yunhui ◽

Liu Guangfu ◽

Liu Zhifeng ◽

Wang Shuwang

Keyword(s):

Uncertainty Factors ◽

Factors Influencing

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Information and energy substitution in the digital economy: an empirical investigation using the input-output approach for Texas

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. ◽

10.1109/isee.2005.1437021 ◽

2005 ◽

Cited By ~ 1

Author(s):

Wei Tu ◽

D.Z. Sui

Keyword(s):

Empirical Investigation ◽

Digital Economy ◽

Input Output ◽

Energy Substitution

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The IPC material declaration handbook

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. ◽

10.1109/isee.2005.1437016 ◽

2005 ◽

Author(s):

J. Sharp

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Analysis of an adaptive fuzzy system for disassembly process planning

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. ◽

10.1109/isee.2005.1437037 ◽

2005 ◽

Cited By ~ 6

Author(s):

M. Turowski ◽

Ying Tang ◽

M. Morgan

Keyword(s):

Process Planning ◽

Fuzzy System ◽

Adaptive Fuzzy ◽

Disassembly Process ◽

Adaptive Fuzzy System

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Impacts of ubiquitous society on the global warming problem in 2010

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. ◽

10.1109/isee.2005.1437020 ◽

2005 ◽

Cited By ~ 2

Author(s):

M. Matsumoto ◽

J. Hamano ◽

T. Tamura ◽

H. Iguchi

Keyword(s):

Global Warming

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Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

80 plus: a strategy for reducing the inherent environmental impacts of computers

New microprocessor features for lower power and increased performance: doing "Moore's" with less

Case study for high volume lead-free wave soldering process with environmental benefits

Packaging in the IT environment - competing challenges in the design of packaging for electronic products

Intelligent disassembly sequence planning for EOL recycling based on hierarchical fuzzy cognitive map

Analyzing and modeling of uncertainty factors influencing product recyclability

Information and energy substitution in the digital economy: an empirical investigation using the input-output approach for Texas

The IPC material declaration handbook

Analysis of an adaptive fuzzy system for disassembly process planning

Impacts of ubiquitous society on the global warming problem in 2010

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.
Latest Publications