Study of Ceramic Capacitor technology link to Electro Chemical Migration in Automotive Electronics

2020 ◽  
Author(s):  
Szasz Francisc
Keyword(s):  
Automotive Electronics ◽  
Ceramic Capacitor ◽  
Chemical Migration

Automotive Electronics

IEE Review ◽  
1992 ◽  
Vol 38 (1) ◽  
pp. 32 ◽  
Author(s):  
M.H. Westbrook
Keyword(s):  
Automotive Electronics

Automotive Electronics

IEE Review ◽  
1988 ◽  
Vol 34 (5) ◽  
pp. 202
Author(s):  
C.H.G. Mills
Keyword(s):  
Automotive Electronics

On Automotive Electronics

2021 ◽  
Vol 16 (4) ◽  
pp. 28-31
Author(s):  
Paul Hansen
Keyword(s):  
Automotive Electronics

scholarly journals Thermoelectric Cooling to Survive Commodity DRAMs in Harsh Environment Automotive Electronics

IEEE Access ◽  
2021 ◽  
pp. 1-1
Author(s):  
Deepak M. Mathew ◽  
Hammam Kattan ◽  
Christian Weis ◽  
Jorg Henkel ◽  
Norbert Wehn ◽  
...  
Keyword(s):  
Harsh Environment ◽  
Automotive Electronics ◽  
Thermoelectric Cooling

On Automotive Electronics

2021 ◽  
Vol 16 (6) ◽  
pp. 24-27
Author(s):  
Paul Hansen
Keyword(s):  
Automotive Electronics

Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

2006 ◽  
Vol 15-17 ◽  
pp. 633-638 ◽  
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Lead Frame ◽  
Shear Forces ◽  
Microstructural Investigation ◽  
Shock Testing ◽  
Ceramic Capacitor ◽  
Board Level ◽  
Board Level Reliability ◽  
Thermal Shocks

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

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