Nature-Inspired Algorithms for EMC and Signal & Power Integrity Applications

IEEE Transactions on Electromagnetic Compatibility ◽

10.1109/temc.2017.2707111 ◽

2017 ◽

Vol 59 (5) ◽

pp. 1654-1654

Keyword(s):

Signal Power ◽

Power Integrity ◽

Nature Inspired Algorithms

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Nature-Inspired Algorithms for EMC and Signal & Power Integrity Applications

IEEE Transactions on Electromagnetic Compatibility ◽

10.1109/temc.2017.2687581 ◽

2017 ◽

Vol 59 (4) ◽

pp. 1272-1272

Keyword(s):

Signal Power ◽

Power Integrity ◽

Nature Inspired Algorithms

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Nature-Inspired Algorithms for EMC and Signal & Power Integrity Applications

IEEE Transactions on Electromagnetic Compatibility ◽

10.1109/temc.2017.2724218 ◽

2017 ◽

Vol 59 (6) ◽

pp. 2055-2055

Keyword(s):

Signal Power ◽

Power Integrity ◽

Nature Inspired Algorithms

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Signal-power integrity and EMI analysis for singlechip and multi-chip-module applications

2013 International Conference on Electromagnetics in Advanced Applications (ICEAA) ◽

10.1109/iceaa.2013.6632389 ◽

2013 ◽

Author(s):

Sidina Wane ◽

Aykut Erdem ◽

Alexis Le Grontec ◽

Olivier Tesson ◽

Serge Bardy ◽

...

Keyword(s):

Signal Power ◽

Power Integrity

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Multi-layer probe card design with signal/power integrity for wafer-level AP test in LPDDR4 channel

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) ◽

10.1109/isemc.2016.7571707 ◽

2016 ◽

Author(s):

Jinwook Song ◽

Jonghoon Kim ◽

Shinyoung Park ◽

Eunjung Lee ◽

Joungho Kim ◽

...

Keyword(s):

Signal Power ◽

Power Integrity ◽

Wafer Level ◽

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2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

10.1109/emcsi31269.2017 ◽

2017 ◽

Keyword(s):

International Symposium ◽

Electromagnetic Compatibility ◽

Signal Power ◽

Power Integrity ◽

Ieee International Symposium

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Signal/power integrity design strategy for low-cost package of high-speed memory I/O interfaces

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2009.5404014 ◽

2009 ◽

Author(s):

Hao-Hsiang Chuang ◽

Chih-Jung Hsu ◽

Ming-Zhang Hong ◽

Darren Hsu ◽

Raphael Huang ◽

...

Keyword(s):

Low Cost ◽

Design Strategy ◽

Signal Power ◽

Power Integrity

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Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters

IEEE Transactions on Electromagnetic Compatibility ◽

10.1109/temc.2010.2072784 ◽

2010 ◽

Vol 52 (4) ◽

pp. 1008-1018 ◽

Author(s):

Francesco de Paulis ◽

Yao-Jiang Zhang ◽

Jun Fan

Keyword(s):

Printed Circuit Boards ◽

Signal Power ◽

Circuit Boards ◽

Power Integrity ◽

Printed Circuit ◽

S Parameters ◽

Integrity Analysis

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Signal/Power Integrity Analysis of High-Speed Memory Module with Meshed Reference Plane

International Journal of Control and Automation ◽

10.14257/ijca.2018.11.7.10 ◽

2018 ◽

Vol 11 (7) ◽

pp. 119-128

Author(s):

Moonjung Kim

Keyword(s):

Reference Plane ◽

Signal Power ◽

Power Integrity ◽

Memory Module ◽

Integrity Analysis

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Technical Program Message: 2022 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity in Spokane, Washington

IEEE Electromagnetic Compatibility Magazine ◽

10.1109/memc.2021.9614253 ◽

2021 ◽

Vol 10 (3) ◽

pp. 76-76

Author(s):

Frank Leferink

Keyword(s):

International Symposium ◽

Electromagnetic Compatibility ◽

Signal Power ◽

Power Integrity ◽

Technical Program ◽

Ieee International Symposium

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Signal/Power Integrity Co-Simulation of DDR3 Memory Module

2018 IEEE International Conference on Computational Electromagnetics (ICCEM) ◽

10.1109/compem.2018.8496538 ◽

2018 ◽

Author(s):

Chao-Kai Chan ◽

Tsung-Ming Wu ◽

Meng-Lin Wu ◽

Gang-Jhih Fan ◽

Chun Shiah ◽

...

Keyword(s):

Signal Power ◽

Power Integrity ◽

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