2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)
Latest Publications

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Published By IEEE

9781424453504

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Modeling and analysis of electromagnetic bandgap structures on power distribution network

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2009.5403992 ◽

2009 ◽

Cited By ~ 1

Author(s):

Sang-Gyu Kim ◽

Hyun Kim ◽

Hee-do Kang ◽

Jong-Gwan Yook

Keyword(s):

Power Distribution ◽

Distribution Network ◽

Electromagnetic Bandgap ◽

Power Distribution Network ◽

Modeling And Analysis

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Novel I/O-bump design and optimization for chip-package codesign

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2009.5404007 ◽

2009 ◽

Author(s):

Ren-Jie Lee ◽

Hung-Ming Chen

Keyword(s):

Design And Optimization

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Substrate integrated high-Q dielectric resonators for low phase noise oscillator

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2009.5403983 ◽

2009 ◽

Cited By ~ 1

Author(s):

Liang Zhou ◽

Wen-yan Yin ◽

Jun-Fa Mao

Keyword(s):

Phase Noise ◽

Dielectric Resonators ◽

High Q ◽

Low Phase Noise

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Fast simulation of power distribution networks based on semi-implicit numerical integration method and RLCG-MNA formulation

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2009.5404002 ◽

2009 ◽

Author(s):

Tomoki Ishimaru ◽

Tadatoshi Sekine ◽

Hideki Asai

Keyword(s):

Numerical Integration ◽

Power Distribution ◽

Integration Method ◽

Distribution Networks ◽

Numerical Integration Method ◽

Fast Simulation ◽

Power Distribution Networks

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Investigation of the gyro-resonance region modes by using the MoM for plasma column loaded cylindrical waveguide

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2009.5403978 ◽

2009 ◽

Cited By ~ 1

Author(s):

Ersoy Kelebekler

Keyword(s):

Plasma Column ◽

Resonance Region ◽

Cylindrical Waveguide

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A novel on-chip fractal power tree network based on leaf vein grids

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2009.5403999 ◽

2009 ◽

Author(s):

HuiFen Huang ◽

QingXin Chu ◽

JianKang Xiao

Keyword(s):

Tree Network ◽

Leaf Vein ◽

On Chip

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A new wide-band 180° planar phase shifter network

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2009.5404015 ◽

2009 ◽

Author(s):

Xu-min Yu ◽

Juan Wang ◽

Xiaohong Tang

Keyword(s):

Phase Shifter ◽

Wide Band ◽

Planar Phase

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Wideband and low-profile antenna by using a unique direct feed approach

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2009.5403988 ◽

2009 ◽

Author(s):

Anping Zhao

Keyword(s):

Low Profile

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A fast and precise eye-diagram estimation method for a channel of a pair of differential microstrip lines on PCB with arbitrary terminations

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2009.5403987 ◽

2009 ◽

Cited By ~ 2

Author(s):

Jeonghyeon Cho ◽

Eakhwan Song ◽

Jongjoo Shim ◽

Yujeong Shim ◽

Joungho Kim

Keyword(s):

Estimation Method ◽

Eye Diagram ◽

Microstrip Lines

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Signal/power integrity design strategy for low-cost package of high-speed memory I/O interfaces

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2009.5404014 ◽

2009 ◽

Cited By ~ 6

Author(s):

Hao-Hsiang Chuang ◽

Chih-Jung Hsu ◽

Ming-Zhang Hong ◽

Darren Hsu ◽

Raphael Huang ◽

...

Keyword(s):

High Speed ◽

Low Cost ◽

Design Strategy ◽

Signal Power ◽

Power Integrity

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2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Modeling and analysis of electromagnetic bandgap structures on power distribution network

Novel I/O-bump design and optimization for chip-package codesign

Substrate integrated high-Q dielectric resonators for low phase noise oscillator

Fast simulation of power distribution networks based on semi-implicit numerical integration method and RLCG-MNA formulation

Investigation of the gyro-resonance region modes by using the MoM for plasma column loaded cylindrical waveguide

A novel on-chip fractal power tree network based on leaf vein grids

A new wide-band 180° planar phase shifter network

Wideband and low-profile antenna by using a unique direct feed approach

A fast and precise eye-diagram estimation method for a channel of a pair of differential microstrip lines on PCB with arbitrary terminations

Signal/power integrity design strategy for low-cost package of high-speed memory I/O interfaces

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)
Latest Publications