Analysis and Temperature Control of Hybrid Microcircuits

1973 ◽  
Vol 95 (4) ◽  
pp. 1048-1052 ◽  
Author(s):  
J. T. Pogson ◽  
J. L. Franklin
Keyword(s):  
Temperature Control ◽  
Thermal Modeling ◽  
Preliminary Design ◽  
Temperature Profiles ◽  
Modeling And Analysis ◽  
Parametric Studies ◽  
Temperature Levels ◽  
Typical Component ◽  
Circuit Designer ◽  
Component Temperature

The results of a study on thermal modeling and analysis of hybrid microcircuits are presented. Parametric studies covering typical component mounting methods, bonding agent materials, and component spacing are described. Temperature profiles of substrates, component temperatures, and thermal resistances are presented. It is shown that the use of moly tabs can significantly reduce component temperature levels. Additionally, it is shown that thermal modeling can greatly aid the circuit designer in the layout and preliminary design phases.

The Minnesota inverted-tee system: Parametric studies for preliminary design

PCI Journal ◽  
2012 ◽  
Vol 57 (2) ◽  
pp. 162-179
Author(s):  
Roberto Piccinin ◽  
Arturo E. Schultz
Keyword(s):  
Preliminary Design ◽  
Parametric Studies

scholarly journals Thermal modeling and analysis of 3D multi-processor chips

Integration ◽  
2010 ◽  
Vol 43 (4) ◽  
pp. 327-341 ◽  
Author(s):  
José L. Ayala ◽  
Arvind Sridhar ◽  
David Cuesta
Keyword(s):  
Thermal Modeling ◽  
Modeling And Analysis

Computational Techniques in Naval Architecture for Rapid Methods in Ship Preliminary Design

2015 ◽  
Author(s):  
Jóannes Gullaksen
Keyword(s):  
Concept Development ◽  
Computational Techniques ◽  
Preliminary Design ◽  
Development Environment ◽  
Safety Level ◽  
Hull Form ◽  
Modeling And Analysis ◽  
Software Application ◽  
Structural Layout ◽  
Design Software

This paper describes a 3D ship design software application for rapid hull definition and analysis during contract and structural layout design phases of a shipbuilding project. The paper provides background for the software application including hull form and structural layout, with advanced hydrostatics and stability, and introduces the regulatory concept of safety level and safety criteria. The software application is a powerful tool for ship concept development and enables efficient development of the contract design to form the foundation of a complete project. The paper also describes the problems associated with software development including development environment and tools together with mathematical modeling and analysis techniques used.

scholarly journals Thermal modeling and analysis of advanced 3D stacked structures

2012 ◽  
Vol 30 ◽  
pp. 248-257 ◽  
Author(s):  
Kameswar Rao Vaddina ◽  
Amir-Mohammad Rahmani ◽  
Khalid Latif ◽  
Pasi Liljeberg ◽  
Juha Plosila
Keyword(s):  
Thermal Modeling ◽  
Modeling And Analysis
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