2015 16th International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications

TOTAL DOCUMENTS

339

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H-INDEX

4

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Published By IEEE

9781467379991

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

An improved substrate structure for high angular color uniformity of white light-emitting diodes

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236771 ◽

2015 ◽

Author(s):

Bofeng Shang ◽

Bin Xie ◽

Xingjian Yu ◽

Qi Chen ◽

Xiaobing Luo

Keyword(s):

White Light ◽

Light Emitting Diodes ◽

Light Emitting ◽

Substrate Structure ◽

Color Uniformity ◽

White Light Emitting Diodes

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Fabrication of a novel cantilever-based device by release the stress in a reliable way

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236786 ◽

2015 ◽

Author(s):

Shuaipeng Wang ◽

Jinling Yang ◽

Yanning Chen ◽

Haifeng Zhang ◽

Dongyan Zhao

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Ultrasonic-assisted soldering of Sn-based alloys during die bonding for high-temperature application

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236650 ◽

2015 ◽

Author(s):

Hongjun Ji ◽

Yunfei Qiao ◽

Mingyu Li

Keyword(s):

High Temperature ◽

High Temperature Application ◽

Ultrasonic Assisted ◽

Temperature Application ◽

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Effects of stirring speed on composition and morphology of non-cyanide co-electroplating Au-Sn thin films

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236814 ◽

2015 ◽

Author(s):

Yawei Liu ◽

Mingliang Huang ◽

Feifei Huang ◽

Ning Zhao

Keyword(s):

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The effects of Au film thickness on the reliability of Sn-Pb solder joints

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236822 ◽

2015 ◽

Author(s):

Xiaorui Lv ◽

Pengrong Lin ◽

Yingzhuo Huang ◽

Xueming Jiang ◽

Binhao Lian ◽

...

Keyword(s):

Film Thickness ◽

Solder Joints ◽

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Thermal modeling and analysis for Ceramic Quad Flat No-lead packages

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236863 ◽

2015 ◽

Author(s):

Peng Bo ◽

Yang Zhentao ◽

Zhao Lu

Keyword(s):

Thermal Modeling ◽

Modeling And Analysis

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Research on the impact of heat treatment on coating quality and reliability of welding after plating nickel

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236825 ◽

2015 ◽

Author(s):

Dongmei Li ◽

Jinchun He ◽

Xiaocheng Feng ◽

Binhao Lian ◽

Yong Wang

Keyword(s):

Heat Treatment ◽

Coating Quality ◽

Quality And Reliability ◽

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Dynamic response of a molded leaded package in wire bonding assembly process

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236599 ◽

2015 ◽

Author(s):

Richard Qian ◽

Yong Liu ◽

Os Jeon ◽

Jerome Teysseyre

Keyword(s):

Dynamic Response ◽

Wire Bonding ◽

Assembly Process

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Ab initio studies of the differences in the chemical reactivity and electronic properties of polyaniline and its derivatives

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236739 ◽

2015 ◽

Author(s):

Junke Jiang ◽

Qiuhua Liang ◽

Chunjian Tan ◽

Miao Cai ◽

Yiping Huang ◽

...

Keyword(s):

Ab Initio ◽

Electronic Properties ◽

Chemical Reactivity

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A Novel Heat Substrate with self-alignment structure for high-power LED packaging

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236756 ◽

2015 ◽

Author(s):

Hao Cheng ◽

Xuebin Zhang ◽

Huai Zheng ◽

Mingxiang Chen

Keyword(s):

High Power Led ◽

Alignment Structure

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