2015 16th International Conference on Electronic Packaging Technology (ICEPT)
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9781467379991
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Effects of stirring speed on composition and morphology of non-cyanide co-electroplating Au-Sn thin films

2015 ◽  
Author(s):  
Yawei Liu ◽  
Mingliang Huang ◽  
Feifei Huang ◽  
Ning Zhao
Keyword(s):  
Thin Films

The effects of Au film thickness on the reliability of Sn-Pb solder joints

2015 ◽  
Author(s):  
Xiaorui Lv ◽  
Pengrong Lin ◽  
Yingzhuo Huang ◽  
Xueming Jiang ◽  
Binhao Lian ◽  
...  
Keyword(s):  
Film Thickness ◽  
Solder Joints ◽  
Au Film

Dynamic response of a molded leaded package in wire bonding assembly process

2015 ◽  
Author(s):  
Richard Qian ◽  
Yong Liu ◽  
Os Jeon ◽  
Jerome Teysseyre
Keyword(s):  
Dynamic Response ◽  
Wire Bonding ◽  
Assembly Process

Ab initio studies of the differences in the chemical reactivity and electronic properties of polyaniline and its derivatives

2015 ◽  
Author(s):  
Junke Jiang ◽  
Qiuhua Liang ◽  
Chunjian Tan ◽  
Miao Cai ◽  
Yiping Huang ◽  
...  
Keyword(s):  
Ab Initio ◽  
Electronic Properties ◽  
Chemical Reactivity

A Novel Heat Substrate with self-alignment structure for high-power LED packaging

2015 ◽  
Author(s):  
Hao Cheng ◽  
Xuebin Zhang ◽  
Huai Zheng ◽  
Mingxiang Chen
Keyword(s):  
High Power ◽  
High Power Led ◽  
Alignment Structure
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