True color tube bore inspection system

2000 ◽  
Author(s):  
Martin J. Pechersky ◽  
Larry J. Harpring
TAPPI Journal ◽  
2009 ◽  
Vol 8 (3) ◽  
pp. 14-20 ◽  
Author(s):  
YUAN-SHING PERNG ◽  
EUGENE I-CHEN WANG ◽  
SHIH-TSUNG YU ◽  
AN-YI CHANG

Trends toward closure of white water recirculation loops in papermaking often lead to a need for system modifications. We conducted a pilot-scale study using pulsed electrocoagulation technology to treat the effluent of an old corrugated containerboard (OCC)-based paper mill in order to evaluate its treatment performance. The operating variables were a current density of 0–240 A/m2, a hydraulic retention time (HRT) of 8–16 min, and a coagulant (anionic polyacrylamide) dosage of 0–22 mg/L. Water quality indicators investigated were electrical con-ductivity, suspended solids (SS), chemical oxygen demand (COD), and true color. The results were encouraging. Under the operating conditions without coagulant addition, the highest removals for conductivity, SS, COD, and true color were 39.8%, 85.7%, 70.5%, and 97.1%, respectively (with an HRT of 16 min). The use of a coagulant enhanced the removal of both conductivity and COD. With an optimal dosage of 20 mg/L and a shortened HRT of 10 min, the highest removal achieved for the four water quality indicators were 37.7%, 88.7%, 74.2%, and 91.7%, respectively. The water qualities thus attained should be adequate to allow reuse of a substantial portion of the treated effluent as process water makeup in papermaking.


2004 ◽  
Vol 58 (3) ◽  
pp. 321-327
Author(s):  
Akihiro Terada
Keyword(s):  

2016 ◽  
Vol 70 (10) ◽  
pp. 1014-1016
Author(s):  
Satoshi Suzuki

Author(s):  
Mike Santana ◽  
Alfredo V. Herrera

Abstract This paper describes a methodology for correlating physical defect inspection/navigation systems with electrical bitmap data through the fabrication of artificial defects via reticle alterations or circuit modifications using an inline FIB. The methodology chosen consisted of altering decommissioned reticles to create defects resulting in both open and shorted circuits within areas of an AMD microprocessor cache. The reticles were subsequently scanned using a KLA SL300HR StarLight inspection system to confirm their location, while wafers processed on these reticles were scanned at several layers using standard inline metrology. Finally, the wafers were electrically tested, bitmapped, and physically deprocessed. All defect data was then analyzed and cross-correlated between each system, uncovering some important system deficiencies and learning opportunities. Data and images are included to support the significance and effectiveness of such a methodology.


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