electrical test
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Author(s):  
Reymart Rio C. Haldos ◽  
Rosula S.J. Reyes ◽  
Patricia Angela R. Abu ◽  
Carlos M. Oppus

Author(s):  
Sherif Haggag ◽  
Loai Nasrat ◽  
Hanafy Ismail

<p>This manuscript introduces the changes of a comprehensive electromechanical properties bundle for low density polyethylene compounded to microscale magnesia (LDPE/MgO) to obtain electrical cables insulating material. Composites of various filler loading weight ratios were prepared by melt intercalation technique; multiple samples were produced in sets as they were cut with definite dimensions as per recommendations of the related testing standard then electrically and mechanically examined following the instruction dictated by the code while preserving typical test condition for all sets. Dielectric strength, volume resistivity, capacitance, and loss angle were the tests of the electrical test pack, while elongation, tensile strength, and melt flow rate were the mechanical and rheological tests applied. Test’s findings were compared to each other’s and to the base material to identify the differentiation. Electrical test results show improvements in the composite features at low loading percentages, whereas the mechanical tests revealed a deterioration in the mechanical properties along with all ratios under investigation. The research aims to determine the compositing benefit extents and drawbacks when a conventional compounding method and inexpensive filler are used, incurring marginal cost impact.</p>


2021 ◽  
Author(s):  
Narongrit Sanajit ◽  
Nutjired Kheowsakul ◽  
Korrapat Chalermwong ◽  
Bussarakam Tongpet ◽  
Pinis Thongmeekwan ◽  
...  

Author(s):  
Tommaso Melis ◽  
Emmanuel Simeu ◽  
Etienne Auvray

Abstract Getting accurate fault isolation during failure analysis is mandatory for success of Physical Failure Analysis (PFA) in critical applications. Unfortunately, achieving such accuracy is becoming more and more difficult with today’s diagnosis tools and actual process node such as BCD9 and FinFET 7 nm, compromising the success of subsequent PFA done on defective SoCs. Electrical simulation is used to reproduce emission microscopy, in our previous work and, in this paper, we demonstrate the possibility of using fault simulation tools with the results of electrical test and fault isolation techniques to provide diagnosis with accurate candidates for physical analysis. The experimental results of the presented flow, from several cases of application, show the validity of this approach.


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