Pulse Reverse Copper Electrodeposition in High Aspect Ratio Trenches and Vias

1998 ◽  
Vol 145 (9) ◽  
pp. 3070-3074 ◽  
Author(s):  
Alan C. West ◽  
Chin‐Chang Cheng ◽  
Brett C. Baker
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Copper Electrodeposition ◽  
Pulse Reverse

Copper Electrodeposition of High-Aspect-Ratio Vias for Three Dimensional Packaging

2003 ◽  
Author(s):  
Kazuo Kondo ◽  
Toshihiro Yonezawa ◽  
Manabu Tomisaka ◽  
Hitoshi Yonemura ◽  
Masataka Hoshino ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Three Dimensional ◽  
Copper Electrodeposition

scholarly journals Copper Electrodeposition in High Aspect Ratio Mesoscale Through-Silicon Vias: Scaling from Die Level to Wafer Level Plating

2020 ◽  
Vol MA2020-02 (25) ◽  
pp. 1787-1787
Author(s):  
Rebecca Pauline Schmitt ◽  
Lyle Alexander Menk ◽  
Matthew Jordan ◽  
Jason Christopher ◽  
Ehren Donel Baca ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Copper Electrodeposition ◽  
Wafer Level ◽  
Through Silicon Vias ◽  
Silicon Vias
Sign in / Sign up

Export Citation Format

Share Document