through silicon vias Latest Research Papers

The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology

IEEE Transactions on Electron Devices ◽

10.1109/ted.2022.3140705 ◽

2022 ◽

pp. 1-4

Author(s):

C.-M. Yen ◽

S.-Y. Chang ◽

K.-C. Chen ◽

Y.-J. Feng ◽

L.-H. Chen ◽

...

Keyword(s):

Carbon Nanotubes ◽

Three Dimensional ◽

High Quality ◽

Through Silicon Vias ◽

Silicon Vias

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Analysis of Through Silicon Vias and substrate coupling in 3D CMOS circuits by Spice simulations

10.1109/iceet53442.2021.9659679 ◽

2021 ◽

Author(s):

Mohamed el Amine Benkechkache ◽

Saida Latreche ◽

Lamis Ghoualmi

Keyword(s):

Cmos Circuits ◽

Through Silicon Vias ◽

Substrate Coupling ◽

Silicon Vias

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(Keynote) Hybrid Bonding and through Silicon Vias - Opportunities and Challenges

ECS Meeting Abstracts ◽

10.1149/ma2021-0214657mtgabs ◽

2021 ◽

Vol MA2021-02 (14) ◽

pp. 657-657

Author(s):

Paul D Franzon

Keyword(s):

Through Silicon Vias ◽

Silicon Vias

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Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias

Journal of The Electrochemical Society ◽

10.1149/1945-7111/ac2bea ◽

2021 ◽

Author(s):

Sang-Hyeok Kim ◽

Hyo-Jong Lee ◽

Trevor Michael Braun ◽

Thomas P. Moffat ◽

Daniel Josell

Keyword(s):

Through Silicon Vias ◽

Silicon Vias

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An analysis of the eddy effect in through-silicon vias based on Cu and CNT bundles: the impact on crosstalk and power

Journal of Computational Electronics ◽

10.1007/s10825-021-01776-7 ◽

2021 ◽

Author(s):

Chopali Chanchal Sahu ◽

Shubham Anand ◽

Manoj Kumar Majumder

Keyword(s):

Through Silicon Vias ◽

Silicon Vias ◽

The Impact

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Study on atomic migration of copper through-silicon-vias with Bosch scallops

Microelectronics Reliability ◽

10.1016/j.microrel.2021.114178 ◽

2021 ◽

Vol 123 ◽

pp. 114178

Author(s):

Zhiqiang Cheng ◽

Yingtao Ding ◽

Lei Xiao ◽

Baoyan Yang ◽

Zhiming Chen

Keyword(s):

Through Silicon Vias ◽

Silicon Vias

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Design of compact LC lowpass filters based on coaxial through-silicon vias array

Microelectronics Journal ◽

10.1016/j.mejo.2021.105217 ◽

2021 ◽

pp. 105217

Author(s):

Xiangkun Yin ◽

Fengjuan Wang ◽

Vasilis F. Pavlidis ◽

Xiaoxian Liu ◽

Qijun Lu ◽

...

Keyword(s):

Through Silicon Vias ◽

Silicon Vias

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Assessment of through‐silicon‐vias with different configurations of ground vias and accounting for substrate losses

International Journal of RF and Microwave Computer-Aided Engineering ◽

10.1002/mmce.22811 ◽

2021 ◽

Author(s):

Yojanes Rodríguez‐Velásquez ◽

Roberto S. Murphy‐Arteaga ◽

Reydezel Torres‐Torres

Keyword(s):

Through Silicon Vias ◽

Silicon Vias

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Constitutive modeling of annealing behavior in through silicon vias-copper

Materials Characterization ◽

10.1016/j.matchar.2021.111359 ◽

2021 ◽

pp. 111359

Author(s):

Yadong Li ◽

Pei Chen ◽

Fei Qin ◽

Tong An ◽

Yanwei Dai ◽

...

Keyword(s):

Constitutive Modeling ◽

Through Silicon Vias ◽

Annealing Behavior ◽

Silicon Vias

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Development of Cu Seed Layers in Ultra-High Aspect Ratio Through-Silicon-Vias (TSVs) with Small Diameters

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00300 ◽

2021 ◽

Author(s):

Ziyue Zhang ◽

Yingtao Ding ◽

Lei Xiao ◽

Ziru Cai ◽

Baoyan Yang ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Through Silicon Vias ◽

Silicon Vias ◽

Seed Layers

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through silicon vias
Recently Published Documents

TOTAL DOCUMENTS

H-INDEX

The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology

Analysis of Through Silicon Vias and substrate coupling in 3D CMOS circuits by Spice simulations

(Keynote) Hybrid Bonding and through Silicon Vias - Opportunities and Challenges

Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias

An analysis of the eddy effect in through-silicon vias based on Cu and CNT bundles: the impact on crosstalk and power

Study on atomic migration of copper through-silicon-vias with Bosch scallops

Design of compact LC lowpass filters based on coaxial through-silicon vias array

Assessment of through‐silicon‐vias with different configurations of ground vias and accounting for substrate losses

Constitutive modeling of annealing behavior in through silicon vias-copper

Development of Cu Seed Layers in Ultra-High Aspect Ratio Through-Silicon-Vias (TSVs) with Small Diameters

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through silicon viasRecently Published Documents

TOTAL DOCUMENTS

H-INDEX

The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology

Analysis of Through Silicon Vias and substrate coupling in 3D CMOS circuits by Spice simulations

(Keynote) Hybrid Bonding and through Silicon Vias - Opportunities and Challenges

Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias

An analysis of the eddy effect in through-silicon vias based on Cu and CNT bundles: the impact on crosstalk and power

Study on atomic migration of copper through-silicon-vias with Bosch scallops

Design of compact LC lowpass filters based on coaxial through-silicon vias array

Assessment of through‐silicon‐vias with different configurations of ground vias and accounting for substrate losses

Constitutive modeling of annealing behavior in through silicon vias-copper

Development of Cu Seed Layers in Ultra-High Aspect Ratio Through-Silicon-Vias (TSVs) with Small Diameters

through silicon vias
Recently Published Documents