through silicon vias
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The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology

2022 ◽  
pp. 1-4
Author(s):  
C.-M. Yen ◽  
S.-Y. Chang ◽  
K.-C. Chen ◽  
Y.-J. Feng ◽  
L.-H. Chen ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
Three Dimensional ◽  
High Quality ◽  
Through Silicon Vias ◽  
Silicon Vias

Analysis of Through Silicon Vias and substrate coupling in 3D CMOS circuits by Spice simulations

2021 ◽  
Author(s):  
Mohamed el Amine Benkechkache ◽  
Saida Latreche ◽  
Lamis Ghoualmi
Keyword(s):  
Cmos Circuits ◽  
Through Silicon Vias ◽  
Substrate Coupling ◽  
Silicon Vias

(Keynote) Hybrid Bonding and through Silicon Vias - Opportunities and Challenges

2021 ◽  
Vol MA2021-02 (14) ◽  
pp. 657-657
Author(s):  
Paul D Franzon
Keyword(s):  
Through Silicon Vias ◽  
Silicon Vias

scholarly journals Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias

2021 ◽  
Author(s):  
Sang-Hyeok Kim ◽  
Hyo-Jong Lee ◽  
Trevor Michael Braun ◽  
Thomas P. Moffat ◽  
Daniel Josell
Keyword(s):  
Through Silicon Vias ◽  
Silicon Vias

An analysis of the eddy effect in through-silicon vias based on Cu and CNT bundles: the impact on crosstalk and power

2021 ◽  
Author(s):  
Chopali Chanchal Sahu ◽  
Shubham Anand ◽  
Manoj Kumar Majumder
Keyword(s):  
Through Silicon Vias ◽  
Silicon Vias ◽  
The Impact

Study on atomic migration of copper through-silicon-vias with Bosch scallops

2021 ◽  
Vol 123 ◽  
pp. 114178
Author(s):  
Zhiqiang Cheng ◽  
Yingtao Ding ◽  
Lei Xiao ◽  
Baoyan Yang ◽  
Zhiming Chen
Keyword(s):  
Through Silicon Vias ◽  
Silicon Vias

Design of compact LC lowpass filters based on coaxial through-silicon vias array

2021 ◽  
pp. 105217
Author(s):  
Xiangkun Yin ◽  
Fengjuan Wang ◽  
Vasilis F. Pavlidis ◽  
Xiaoxian Liu ◽  
Qijun Lu ◽  
...  
Keyword(s):  
Through Silicon Vias ◽  
Silicon Vias

Assessment of through‐silicon‐vias with different configurations of ground vias and accounting for substrate losses

2021 ◽  
Author(s):  
Yojanes Rodríguez‐Velásquez ◽  
Roberto S. Murphy‐Arteaga ◽  
Reydezel Torres‐Torres
Keyword(s):  
Through Silicon Vias ◽  
Silicon Vias

Constitutive modeling of annealing behavior in through silicon vias-copper

2021 ◽  
pp. 111359
Author(s):  
Yadong Li ◽  
Pei Chen ◽  
Fei Qin ◽  
Tong An ◽  
Yanwei Dai ◽  
...  
Keyword(s):  
Constitutive Modeling ◽  
Through Silicon Vias ◽  
Annealing Behavior ◽  
Silicon Vias

Development of Cu Seed Layers in Ultra-High Aspect Ratio Through-Silicon-Vias (TSVs) with Small Diameters

2021 ◽  
Author(s):  
Ziyue Zhang ◽  
Yingtao Ding ◽  
Lei Xiao ◽  
Ziru Cai ◽  
Baoyan Yang ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Through Silicon Vias ◽  
Silicon Vias ◽  
Seed Layers
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