Modeling the Bottom-Up Filling of Through-Silicon vias Through Suppressor Adsorption/Desorption Mechanism

2013 ◽  
Vol 160 (12) ◽  
pp. D3051-D3056 ◽  
Author(s):  
Liu Yang ◽  
Aleksandar Radisic ◽  
Johan Deconinck ◽  
Philippe M. Vereecken
Keyword(s):  
Bottom Up ◽  
Through Silicon Vias ◽  
Desorption Mechanism ◽  
Silicon Vias ◽  
Adsorption Desorption

Bottom-up Copper Electrodeposition in 20:1 Aspect Ratio, 20 Μm Pitch through Silicon Vias

2020 ◽  
Vol MA2020-02 (25) ◽  
pp. 1791-1791
Author(s):  
Lyle Alexander Menk ◽  
Rebecca Pauline Schmitt ◽  
William Moyer Mook ◽  
Kate Musick ◽  
Jaime McClain ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Copper Electrodeposition ◽  
Bottom Up ◽  
Through Silicon Vias ◽  
Silicon Vias

Cu Bottom-Up Filling for Through Silicon Vias with Growing Surface Established by the Modulation of Leveler and Suppressor

2013 ◽  
Vol 160 (12) ◽  
pp. D3221-D3227 ◽  
Author(s):  
Myung Jun Kim ◽  
Hoe Chul Kim ◽  
Seunghoe Choe ◽  
Ji Yoon Cho ◽  
Donghyung Lee ◽  
...  
Keyword(s):  
Bottom Up ◽  
Through Silicon Vias ◽  
Silicon Vias
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