Superconformal Bottom-up Nickel Deposition in High Aspect Ratio through Silicon Vias

ECS Meeting Abstracts ◽

10.1149/ma2016-02/19/1560 ◽

2016 ◽

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Nickel Deposition ◽

Bottom Up ◽

Through Silicon Vias ◽

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Superconformal Bottom-up Nickel Deposition in High Aspect Ratio through Silicon Vias

ECS Transactions ◽

10.1149/07502.0019ecst ◽

2016 ◽

Vol 75 (2) ◽

pp. 19-24 ◽

Author(s):

D. Josell ◽

T. P. Moffat

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Nickel Deposition ◽

Bottom Up ◽

Through Silicon Vias ◽

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Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias

Journal of The Electrochemical Society ◽

10.1149/2.1151607jes ◽

2016 ◽

Vol 163 (7) ◽

pp. D322-D331 ◽

Author(s):

D. Josell ◽

T. P. Moffat

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Nickel Deposition ◽

Bottom Up ◽

Through Silicon Vias ◽

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Superconformal Bottom-up Cobalt Deposition in High Aspect Ratio through Silicon Vias

ECS Meeting Abstracts ◽

10.1149/ma2016-02/19/1561 ◽

2016 ◽

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Bottom Up ◽

Through Silicon Vias ◽

Silicon Vias ◽

Cobalt Deposition

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A Deeper Look at Bottom-up Copper Deposition in High Aspect Ratio through Silicon Vias

ECS Meeting Abstracts ◽

10.1149/ma2018-01/19/1246 ◽

2018 ◽

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Copper Deposition ◽

Bottom Up ◽

Through Silicon Vias ◽

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Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias

Journal of The Electrochemical Society ◽

10.1149/2.1311706jes ◽

2017 ◽

Vol 164 (6) ◽

pp. D327-D334 ◽

Author(s):

D. Josell ◽

T. P. Moffat

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Gold Deposition ◽

Bottom Up ◽

Through Silicon Vias ◽

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Bottom-up copper electroplating using transfer wafers for fabrication of high aspect-ratio through-silicon-vias

Microelectronic Engineering ◽

10.1016/j.mee.2009.06.029 ◽

2010 ◽

Vol 87 (3) ◽

pp. 510-513 ◽

Author(s):

Chongshen Song ◽

Zheyao Wang ◽

Litian Liu

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Bottom Up ◽

Through Silicon Vias ◽

Copper Electroplating ◽

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Enhancing the Wettability of High Aspect-Ratio Through-Silicon Vias Lined With LPCVD Silicon Nitride or PE-ALD Titanium Nitride for Void-Free Bottom-Up Copper Electroplating

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2011.2167969 ◽

2011 ◽

Vol 1 (11) ◽

pp. 1728-1738 ◽

Author(s):

Mohamed Saadaoui ◽

Henk van Zeijl ◽

Wilhelmus H. A. Wien ◽

Hoa T. M. Pham ◽

Cees Kwakernaak ◽

...

Keyword(s):

Silicon Nitride ◽

Aspect Ratio ◽

Titanium Nitride ◽

High Aspect Ratio ◽

Bottom Up ◽

Through Silicon Vias ◽

Copper Electroplating ◽

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Superconformal Bottom-up Gold Deposition in High Aspect Ratio through Silicon Vias

ECS Meeting Abstracts ◽

10.1149/ma2017-02/16/932 ◽

2017 ◽

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Gold Deposition ◽

Bottom Up ◽

Through Silicon Vias ◽

Download Full-text

Superconformal Bottom-up Cobalt Deposition in High Aspect Ratio through Silicon Vias

ECS Transactions ◽

10.1149/07502.0025ecst ◽

2016 ◽

Vol 75 (2) ◽

pp. 25-30 ◽

Author(s):

D. Josell ◽

M. Silva ◽

T. P. Moffat

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Bottom Up ◽

Through Silicon Vias ◽

Silicon Vias ◽

Cobalt Deposition

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Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias

Journal of The Electrochemical Society ◽

10.1149/2.0861614jes ◽

2016 ◽

Vol 163 (14) ◽

pp. D809-D817 ◽

Author(s):

D. Josell ◽

M. Silva ◽

T. P. Moffat

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Bottom Up ◽

Through Silicon Vias ◽

Silicon Vias ◽

Cobalt Deposition

Download Full-text