(Invited) Electrodeposition of Si in CsF–CsCl Eutectic Melt

2021 ◽  
Vol MA2021-01 (24) ◽  
pp. 920-920
Author(s):  
Yutaro Norikawa ◽  
Airi Kondo ◽  
Kouji Yasuda ◽  
Toshiyuki Nohira
Keyword(s):  
Eutectic Melt

Electrical Conductance of the LiCl–KCl Eutectic Melt Containing Halides and Alkali Titanium Fluorides as Solutes

1958 ◽  
Vol 62 (12) ◽  
pp. 1479-1482 ◽  
Author(s):  
George J. Janz ◽  
C. T. Brown ◽  
H. J. Gardner ◽  
C. Solomons
Keyword(s):  
Electrical Conductance ◽  
Eutectic Melt

Thermoelectric Studies of Silver Nitrate in Sodium Nitrate – Potassium Nitrate Eutectic Melt

1971 ◽  
Vol 49 (12) ◽  
pp. 2044-2047
Author(s):  
L. G. Boxall ◽  
K. E. Johnson
Keyword(s):  
Seebeck Coefficient ◽  
Silver Nitrate ◽  
Mole Fraction ◽  
Sodium Nitrate ◽  
Nitrate Concentration ◽  
Potassium Nitrate ◽  
Silver Nitrate Concentration ◽  
Eutectic Melt

The Seebeck coefficient, εT, of the thermocell Ag(T)/AgNO3 in NaNO3 − KNO3/Ag (T + ΔT) was measured as a function of silver nitrate concentration and temperature. Extrapolation of the results to unit mole fraction, N, of AgNO3 gave the value εT0 = − 277.5 − 0.136T °C (µV deg−1).For several mixed melts of AgNO3 and an alkali nitrate the function [Formula: see text] was calculated and shown to be linear in N. P was extrapolated to finite values for the pure alkali nitrates.

Abnormal dynamic behavior and structural origin of Cu-Ag eutectic melt

2021 ◽  
Vol 207 ◽  
pp. 116705
Author(s):  
B.Q. Wu ◽  
L.T. Kong ◽  
J.F. Li
Keyword(s):  
Dynamic Behavior ◽  
Eutectic Melt

Eutectic Bonding of Copper to Ceramics

1984 ◽  
Vol 40 ◽  
Author(s):  
Marc Wittmer
Keyword(s):  
Bond Strength ◽  
Electronic Packaging ◽  
Mechanical Engineering ◽  
Oxide Ceramics ◽  
Strong Bond ◽  
Eutectic Bonding ◽  
Eutectic Melt

AbstractEutectic bonding of copper to ceramics makes use of a liquid eutectic between copper and oxygen at 1065°C which wets oxide ceramics very well. Upon solidification of the eutectic melt a very strong bond is established which has a strength of about 5×107N/m2. The excellent bond strength gives this technique important applications in electronic packaging and mechanical engineering.

Thermodynamic and Kinetic Properties of Oxide Ions in a LiCl–KCl–CsCl Eutectic Melt

2013 ◽  
Vol 160 (9) ◽  
pp. E90-E93 ◽  
Author(s):  
Yuya Kado ◽  
Takuya Goto ◽  
Rika Hagiwara
Keyword(s):  
Kinetic Properties ◽  
Oxide Ions ◽  
Eutectic Melt
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