Improving OBC Data Quality of the Geophone Components in Shallow-Water Persian Gulf Through Advanced Time-Frequency Analysis

2012 ◽  
Author(s):  
Zhao Zhang ◽  
Yuefeng Sun ◽  
Karl Berteussen
2008 ◽  
Vol 123 (5) ◽  
pp. 3945-3945
Author(s):  
Shaun D. Anderson ◽  
Karim G. Sabra ◽  
Manell E. Zakharia ◽  
Mario Zampolli ◽  
Henrik Schmidt ◽  
...  

2006 ◽  
Vol 120 (5) ◽  
pp. 3221-3221
Author(s):  
Mohsen Badiey ◽  
Valery Grigorev ◽  
Boris Katsnelson ◽  
James Lynch

2021 ◽  
Vol 17 (5) ◽  
pp. 155014772110183
Author(s):  
Wuwei Feng ◽  
Xin Chen ◽  
Cuizhu Wang ◽  
Yuzhou Shi

Imperfection in a bonding point can affect the quality of an entire integrated circuit. Therefore, a time–frequency analysis method was proposed to detect and identify fault bonds. First, the bonding voltage and current signals were acquired from the ultrasonic generator. Second, with Wigner–Ville distribution and empirical mode decomposition methods, the features of bonding electrical signals were extracted. Then, the principal component analysis method was further used for feature selection. Finally, an artificial neural network was built to recognize and detect the quality of ultrasonic wire bonding. The results showed that the average recognition accuracy of Wigner–Ville distribution and empirical mode decomposition was 78% and 93%, respectively. The recognition accuracy of empirical mode decomposition is obviously higher than that of the Wigner–Ville distribution method. In general, using the time–frequency analysis method to classify and identify the fault bonds improved the quality of the wire-bonding products.


2018 ◽  
Vol 158 ◽  
pp. 123-131 ◽  
Author(s):  
Ravindra Pethiyagoda ◽  
Timothy J. Moroney ◽  
Gregor J. Macfarlane ◽  
Jonathan R. Binns ◽  
Scott W. McCue

1997 ◽  
Vol 117 (3) ◽  
pp. 338-345 ◽  
Author(s):  
Masatake Kawada ◽  
Masakazu Wada ◽  
Zen-Ichiro Kawasaki ◽  
Kenji Matsu-ura ◽  
Makoto Kawasaki

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