Application of CSEM method to study deep copper-sulphide deposits

Author(s):  
Kseniia Antashchuk ◽  
Alexey Atakov ◽  
Anton Kocherov ◽  
Maria Smirnova ◽  
Denis Bogdanovich ◽  
...  
2018 ◽  
Vol 7 ◽  
pp. 139-145
Author(s):  
Wen Yafeng ◽  
◽  
U.D. Izabaev ◽  
A.K. Ukubaev ◽  
E.A. Zavarukhina ◽  
...  
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Author(s):  
Anil Kurella ◽  
Aravind Munukutla ◽  
J.S. Lewis

Abstract PCB surface finishes like Immersion silver (ImAg) are commonly used in Pb-free manufacturing environments following RoHS legislation. With this transition, however the numbers of field failures associated with electrochemical migration, copper sulphide corrosion, via barrel galvanic corrosion are on a steady rise. More often than not ImAg surfaces seem to assist these failing signatures. As computers penetrate into emerging markets with humid and industrialized environments there is a greater concern on the reliability and functionality of these electronic components.


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2021 ◽  
Vol 2021 (212) ◽  
pp. 48-51
Author(s):  
Don Emerson
Keyword(s):  

2021 ◽  
Vol 183 ◽  
pp. 109313
Author(s):  
Joakim Halldin Stenlid ◽  
Egon Campos dos Santos ◽  
Adam Johannes Johansson ◽  
Lars G.M. Pettersson
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