Stress Intensity Factor Analysis of Interface Crack using Boundary Element Method : Application of Virtual Crack Extension Method

1993 ◽  
Vol 36 (1) ◽  
pp. 36-42 ◽  
Author(s):  
Noriyuki Miyazaki ◽  
Toru Ikeda ◽  
Toshihiro Soda ◽  
Tsuyoshi Munakata
Keyword(s):  
Stress Intensity Factor ◽  
Factor Analysis ◽  
Stress Intensity ◽  
Boundary Element Method ◽  
Intensity Factor ◽  
Boundary Element ◽  
Crack Extension ◽  
Extension Method ◽  
Virtual Crack Extension ◽  
Virtual Crack Extension Method

Research on Fracture Behavior of a Cracked Film-Substrate Medium

2006 ◽  
Vol 324-325 ◽  
pp. 903-906
Author(s):  
Bao Liang Liu ◽  
Xian Shun Bi
Keyword(s):  
Stress Intensity Factor ◽  
Stress Intensity ◽  
Boundary Element Method ◽  
Intensity Factor ◽  
Boundary Element ◽  
Fracture Behavior ◽  
Thickness Ratio ◽  
Film Substrate ◽  
Substrate Medium ◽  
Element Method

This study gives the problem of a crack in the film oriented perpendicular to the film-substrate interface with the crack tip terminating at the interface. Based on Beuth’s theory, three-dimensional model is simplified to plane strain problems, which obtains fracture mechanisms of a cracked film-substrate medium by applying the boundary element method(BEM). The method aptly resolves the problem involving stress concentration and, further, that this study develops the multi-region boundary element method and applies it to evaluate the cracked film-substrate medium. It shows that the stress intensity factor is affected by the different elastic mismatches and the thickness ratio of the film and the substrate. These results indicate: 1) The stress intensity factor has remarkable increased with the decrease of the thickness ratio of the film and the substrate. The effect of the fracture behavior of film is negligible when the thickness ratio of the film and the substrate is above 10, therefore, it is treated as thin film; 2) The stress intensity factor will decrease with the increase of α ( −1 pα p +1) for β = 0 and β =α / 4 , where α and β are called Dundurs parameters. What’s more, this paper studies the special condition of the film-substrate medium, which is the analysis of the fracture of the absence of any elastic mismatch between the film and the substrate, i.e.α=β=0, and revision of the formula of Xia and Hutchinson is put forward for the stress intensity factor of the deep crack problems by comparing to the former conclusions of Y.Murakami.

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