Cooling unit for high-density packaging ICT rack by using boiling heat transfer (Evaluation on basic cooling performance of low height type thermosyphon)
2014 ◽
Vol 80
(815)
◽
pp. TEP0202-TEP0202
◽
Takayuki FUJIMOTO
◽
Fumio TAKEDA
◽
Yoshihiro KONDO
◽
Tatsuo FUJII
◽
Takeshi KATO
2006 ◽
Vol 72
(718)
◽
pp. 1388-1395
◽
Kiyoshi KAWAGUCHI
◽
Tadayoshi TERAO
◽
Tatsuhito MATSUMOTO
Takashi Fukue
◽
Koichi Hirose
◽
Hidemi Shirakawa
1998 ◽
Vol 29
(1-3)
◽
pp. 196-207
Haruhiko Ohta
◽
Koichi Inoue
◽
Suguru Yoshida
◽
Tomoji S. Morita
Akira Sakurai
◽
Masahiro Shiotsu
◽
Koichi Hata
L. L. Vasiliev, Jr
◽
S. K. Vinokurov
◽
O. G. Rasin
R.K. Lui
◽
Masahiro Kawaji
◽
T. Ogushi
Kevin M. Kirk
◽
Herman Merte, Jr.
Erich Hahne
◽
R. Windisch
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