scholarly journals Cooling unit for high-density packaging ICT rack by using boiling heat transfer (Evaluation on basic cooling performance of low height type thermosyphon)

2014 ◽  
Vol 80 (815) ◽  
pp. TEP0202-TEP0202 ◽  
Author(s):  
Takayuki FUJIMOTO ◽  
Fumio TAKEDA ◽  
Yoshihiro KONDO ◽  
Tatsuo FUJII ◽  
Takeshi KATO
1998 ◽  
Vol 29 (1-3) ◽  
pp. 196-207
Author(s):  
Haruhiko Ohta ◽  
Koichi Inoue ◽  
Suguru Yoshida ◽  
Tomoji S. Morita

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