Abstract
Thermal spray layers are formed on rough surfaces; however, the flattening process on rough surfaces has not yet been clarified. A mathematical flattening model which takes into account the roughness of the substrate or previously coated layers is proposed in this paper. As a result of surface roughness, the flattening degree and the flattening time decrease with increasing surface roughness in this model. In addition, the characterization of surface roughness is introduced for the flattening model. Several calculated cases of the flattening model are shown.
ABSTRACTSingle probe infrared low coherence optical interferometry has been proven to be an effective tool for characterization of thin and ultra-thin semiconductor Si and compound materials wafers. Its application was however limited to wafers transparent at probing wavelength, and having relatively smooth surfaces. Purpose of this paper is to present an extension of low coherence interferometry to characterization of non-transparent wafers, and wafers with rough surfaces.
Self-referenced characterization of optical frequency combs and arbitrary waveforms using a simple, linear, zero-delay implementation of spectral shearing interferometry
