Interdiffusion and stress development in Ni-Cu thin film diffusion couples

Author(s):  
Y. Kuru ◽  
J. Chakraborty ◽  
U. Welzel ◽  
M. Wohlschlögel ◽  
Eric J. Mittemeijer

2008 ◽  
Vol 516 (21) ◽  
pp. 7615-7626 ◽  
Author(s):  
Y. Kuru ◽  
M. Wohlschlögel ◽  
U. Welzel ◽  
E.J. Mittemeijer

2010 ◽  
Vol 518 (8) ◽  
pp. 2010-2020 ◽  
Author(s):  
J. Chakraborty ◽  
U. Welzel ◽  
E.J. Mittemeijer

1995 ◽  
Vol 67 (19) ◽  
pp. 2795-2797 ◽  
Author(s):  
K. F. Dreyer ◽  
W. K. Neils ◽  
R. R. Chromik ◽  
D. Grosman ◽  
E. J. Cotts

Sign in / Sign up

Export Citation Format

Share Document