Interdiffusion, phase formation, and stress development in Cu–Pd thin-film diffusion couples: Interface thermodynamics and mechanisms
Keyword(s):
2009 ◽
Vol 2009
(30)
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pp. 247-252
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Keyword(s):
Keyword(s):
2006 ◽
pp. 405-412
Keyword(s):
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Keyword(s):
Keyword(s):
1978 ◽
Vol 15
(2)
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pp. 244-247
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