scholarly journals Simulation and Experimental Verification of Thermal Property for Aluminum Nitrides and Copper Clad Laminates under Space Thermal Environment

2019 ◽  
pp. 37
Author(s):  
HE Duan-Peng ◽  
GAO Hong ◽  
ZHANG Jing-Jing ◽  
WU Jie ◽  
LIU Bo-Tian ◽  
...  
2012 ◽  
Author(s):  
Alberto Miguel ◽  
Nelson Rodrigues ◽  
Senhorinha Teixeira ◽  
Jose Teixeira ◽  
Ricardo Oliveira

2017 ◽  
Vol 137 (8) ◽  
pp. 631-638 ◽  
Author(s):  
Hiroki Yamano ◽  
Koji Takechi ◽  
Hiroaki Kakigano ◽  
Makoto Ohashi

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