Thermal effects on GFRP rebars: experimental study and analytical analysis

2009 ◽  
Vol 43 (6) ◽  
pp. 775-788 ◽  
Author(s):  
Abdelmonem Masmoudi ◽  
Radhouane Masmoudi ◽  
Mongi Ben Ouezdou
2001 ◽  
Vol 32 (4-6) ◽  
pp. 5
Author(s):  
A. A. Dolinsky ◽  
Yu. A. Shurchkova ◽  
B. I. Basok ◽  
T. S. Ryzhkova

2001 ◽  
Author(s):  
Wei Han ◽  
Ryszard J. Pryputniewicz

Abstract Advances in microelectronics depend on reliable packaging. As sizes of components decrease and number of components per package increases, demands on interconnections, or joining, of two parts, e.g., wire to tab, or tab to tab, increase rapidly. Since traditional joining techniques, such as resistance welding, may no longer produce satisfactory microinterconnections, alternative methods are being developed. One of such methods is based on laser microwelding. In this paper, we discuss fundamental processes involved in laser microwelding, outline a computational methodology to simulate thermal effects produced, describe facilities used, present results, and summarize correlations between the experimental and computational data for applications in electronic packaging.


2012 ◽  
Vol 32 (6) ◽  
pp. 0614002 ◽  
Author(s):  
杨经纬 Yang Jingwei ◽  
王礼 Wang Li ◽  
吴先友 Wu Xianyou ◽  
江海河 Jiang Haihe

Measurement ◽  
2017 ◽  
Vol 102 ◽  
pp. 96-105 ◽  
Author(s):  
Jayant Kumar ◽  
Vipender S. Negi ◽  
Kashi D. Chattopadhyay ◽  
RamaGopal V. Sarepaka ◽  
Ravindra K. Sinha

2017 ◽  
Vol 22 (7) ◽  
pp. 04017034 ◽  
Author(s):  
Qi Xia ◽  
Jian Zhang ◽  
Yongding Tian ◽  
Yufeng Zhang

2019 ◽  
Vol 99 (1) ◽  
pp. 373-391 ◽  
Author(s):  
Antonio Zippo ◽  
Marco Barbieri ◽  
Giovanni Iarriccio ◽  
Francesco Pellicano

2018 ◽  
Vol 12 (2) ◽  
pp. 42-51 ◽  
Author(s):  
Adam Gnatowski ◽  
Marcin Sosnowski ◽  
Anna Pajdak ◽  
Jacek Sobczyk

Sign in / Sign up

Export Citation Format

Share Document