scholarly journals Application of “8D Methodology" for the Root Cause Analysis and Reduction of Valve Spring Rejection in a Valve Spring Manufacturing Company: A Case Study

2017 ◽  
Vol 10 (11) ◽  
pp. 1-11 ◽  
Author(s):  
T. S. M. Kumar ◽  
B. Adaveesh ◽  
◽  
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Valve Spring ◽  
Root Cause ◽  
Manufacturing Company

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

Root cause analysis of primary reformer catastrophic failure: A case study

2010 ◽  
Vol 30 (1) ◽  
pp. 62-65
Author(s):  
Naveed Ramzan ◽  
Shahid Naveed ◽  
Muhammad Rizwan ◽  
Werner Witt
Keyword(s):  
Root Cause Analysis ◽  
Catastrophic Failure ◽  
Cause Analysis ◽  
Root Cause

Root Cause Analysis of Glovebox Glove Failure

2007 ◽  
Author(s):  
Y. H. Park ◽  
Michael Cournoyer
Keyword(s):  
Safety Concern ◽  
National Laboratory ◽  
Root Cause Analysis ◽  
Nuclear Materials ◽  
Alamos National Laboratory ◽  
Cause Analysis ◽  
Los Alamos National Laboratory ◽  
Root Cause ◽  
Analysis Process

The Nuclear Materials Technology (NMT) Division has the largest inventory of glovebox gloves at Los Alamos National Laboratory (LANL). Consequently, the minimization of unplanned breaches of the glove material, typically resulting in glove failures, is a significant safety concern in the daily operations in NMT Division facilities. To investigate processes and procedures that minimize unplanned breaches in the glovebox, information on glovebox glove failures has been compiled from formal records and analyzed using statistical methods. Based on these research results, the next step of the research is to identify root causes of glove failures and the actions adequate to prevent recurrence. In this paper, root cause analysis was conducted for a cleanup breach case study to demonstrate the computerized root cause analysis process. Based on analysis results, effective recommendations were generated.

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