scholarly journals X-ray Computed Tomography Imaging of Printed Circuit Boards

2018 ◽  
Author(s):  
W. Brown ◽  
K. Champley ◽  
S. Glenn ◽  
H. Martz
Author(s):  
Daechul Choi ◽  
Sooyoung Ji ◽  
Jaelim Choi ◽  
Miyang Kim ◽  
Eunju Yang ◽  
...  

Abstract In this paper, we demonstrate a case for non-destructive detection of submicron wide via-crack in printed circuit boards (PCBs) by using in-situ thermal chamber 3D x-ray computed tomography. The defect location is verified by a PFA (Physical Failure Analysis), and good agreement was made. This fault isolation method is proposed as a possible solution for identifying submicron cracks in PCB substrates during challenging investigations.


2011 ◽  
Vol 39 (1) ◽  
pp. 424-428 ◽  
Author(s):  
Nicholas Bevins ◽  
Joseph Zambelli ◽  
Ke Li ◽  
Zhihua Qi ◽  
Guang-Hong Chen

2007 ◽  
Vol 2 (6) ◽  
pp. 292-293
Author(s):  
S. Roux ◽  
C. Alric ◽  
J. Taleb ◽  
C. Mandon ◽  
C. Billotey ◽  
...  

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