In-Situ Thermal Chamber 3D X-Ray Computed Tomography for Non-Destructive Detection of Submicron Via-Crack in Printed Circuit Boards
Keyword(s):
X Ray
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Abstract In this paper, we demonstrate a case for non-destructive detection of submicron wide via-crack in printed circuit boards (PCBs) by using in-situ thermal chamber 3D x-ray computed tomography. The defect location is verified by a PFA (Physical Failure Analysis), and good agreement was made. This fault isolation method is proposed as a possible solution for identifying submicron cracks in PCB substrates during challenging investigations.