Modeling of hybrid laser-MIG keyhole welding process

Author(s):  
J. Zhou ◽  
H. L. Tsai ◽  
P. C. Wang ◽  
R. J. Menassa ◽  
S. P. Marin
Author(s):  
Jun Zhou ◽  
Hai-Lung Tsai

Dual-beam laser welding has become an emerging joining technique. Studies have demonstrated that it can provide benefits over conventional single-beam laser welding, such as increasing keyhole stability, slowing down cooling rate and delaying the humping onset to a higher welding speed. It is also reported to be able to improve weld quality significantly. However, due to its complexity the development of this promising technique has been limited to the trial-and-error procedure. In this study, mathematical models are developed to investigate the heat transfer, melt flow, and solidification process in three-dimensional dual-beam laser keyhole welding. Effects of key parameters, such as laser-beam configuration on melt flow, weld shape, and keyhole dynamics are studied. Some experimentally observed phenomena, such as the changes of the weld pool shape from oval to circle and from circle to oval during the welding process are analyzed in current study.


Automatica ◽  
2007 ◽  
Vol 43 (5) ◽  
pp. 876-884 ◽  
Author(s):  
Y.M. Zhang ◽  
Y.C. Liu

2016 ◽  
Vol 238 ◽  
pp. 65-72 ◽  
Author(s):  
ZuMing Liu ◽  
YueXiao Fang ◽  
ShuangLin Cui ◽  
Zhen Luo ◽  
WeiDong Liu ◽  
...  

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
M. T. Hessmann ◽  
T. Kunz ◽  
M. Voigt ◽  
K. Cvecek ◽  
M. Schmidt ◽  
...  

An extended monocrystalline silicon base foil offers a great opportunity to combine low-cost production with high efficiency silicon solar cells on a large scale. By overcoming the area restriction of ingot-based monocrystalline silicon wafer production, costs could be decreased to thin film solar cell range. The extended monocrystalline silicon base foil consists of several individual thin silicon wafers which are welded together. A comparison of three different approaches to weld 50 μm thin silicon foils is investigated here: (1) laser spot welding with low constant feed speed, (2) laser line welding, and (3) keyhole welding. Cross-sections are prepared and analyzed by electron backscatter diffraction (EBSD) to reveal changes in the crystal structure at the welding side after laser irradiation. The treatment leads to the appearance of new grains and boundaries. The induced internal stress, using the three different laser welding processes, was investigated by micro-Raman analysis. We conclude that the keyhole welding process is the most favorable to produce thin silicon foils.


2015 ◽  
Vol 78 ◽  
pp. 182-191 ◽  
Author(s):  
Josefine Svenungsson ◽  
Isabelle Choquet ◽  
Alexander F.H. Kaplan

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