scholarly journals Analysis of Thermal Stresses in Thin Circular Plate Due to Moving Heat Source

Author(s):  
Yogita M. Ahire et al., Yogita M. Ahire et al., ◽  
2021 ◽  
Author(s):  
Sangita Pimpare ◽  
Chandrashekhar Shalik Sutar ◽  
Kamini Chaudhari

Abstract In the proposed research work we have used the Gaussian circular heat source. This heat source is applied with the heat flux boundary condition along the thickness of a circular plate with a nite radius. The research work also deals with the formulation of unsteady-state heat conduction problems along with homogeneous initial and non-homogeneous boundary condition around the temperature distribution in the circular plate. The mathematical model of thermoelasticity with the determination of thermal stresses and displacement has been studied in the present work. The new analytical method, Reduced Differential Transform has been used to obtain the solution. The numerical results are shown graphically with the help of mathematical software SCILAB and results are carried out for the material copper.


1985 ◽  
Vol 51 (468) ◽  
pp. 1973-1976
Author(s):  
Masatoshi TSUJI ◽  
Yoshinobu TANIGAWA ◽  
Yoitiro TAKEUTI

2011 ◽  
Vol 1 (3) ◽  
pp. 031007
Author(s):  
K.C. Deshmukh ◽  
Y.I. Quazi ◽  
S.D. Warbhe ◽  
V.S. Kulkarni

A hollow cylinder having cylindrical hole at the center has been examined under the temperature variation condition. This composition deals with study of temperature distribution in thin hollow cylinder and corresponding stresses. The author has worked to carry out the transient thermo elastic problem for evaluation of temperature distribution, displacement and thermal stresses of a thin hollow cylinder. The known non homogeneous boundary conditions are applied to obtain the solution of this problem. The integral transform technique yields the solution to the problem. The analysis contains an infinite series. The variation of said parameters observed and analyzed by using necessary graphs


2008 ◽  
Vol 131 (2) ◽  
Author(s):  
M. Jabbari ◽  
A. H. Mohazzab ◽  
A. Bahtui

This paper presents the analytical solution of one-dimensional mechanical and thermal stresses for a hollow cylinder made of functionally graded material. The material properties vary continuously across the thickness, according to the power functions of radial direction. Temperature distribution is symmetric and transient. The thermal boundary conditions may include conduction, flux, and convection for inside or outside of a hollow cylinder. The thermoelasticity equation is transient, including the moving heat source. The heat conduction and Navier equations are solved analytically, using the generalized Bessel function. A direct method of solution of Navier equation is presented.


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