Parallel finite element algorithm for three-dimensional inviscid and viscous flow

10.2514/3.652 ◽  
1995 ◽  
Vol 9 (2) ◽  
pp. 240-246 ◽  
Author(s):  
Frank P. Brueckner ◽  
Darrell W. Pepper
Keyword(s):  
Finite Element ◽  
Viscous Flow ◽  
Three Dimensional ◽  
Parallel Finite Element ◽  
Element Algorithm

Local and parallel finite element algorithm based on the partition of unity method for the incompressible MHD flow

2017 ◽  
Vol 44 (4) ◽  
pp. 1295-1319 ◽  
Author(s):  
Xiaojing Dong ◽  
Yinnian He ◽  
Hongbo Wei ◽  
Yuhong Zhang
Keyword(s):  
Finite Element ◽  
Partition Of Unity ◽  
Mhd Flow ◽  
Partition Of Unity Method ◽  
Parallel Finite Element ◽  
Incompressible Mhd ◽  
Element Algorithm

scholarly journals AN EFFICIENT FINITE-ELEMENT-ALGORITHM FOR THREE-DIMENSIONAL FRACTURE PROBLEMS

Fracture 84 ◽  
1984 ◽  
pp. 1079-1086
Author(s):  
M. Kuna ◽  
V. Schmidt
Keyword(s):  
Finite Element ◽  
Three Dimensional ◽  
Element Algorithm

Local and Parallel Finite Element Algorithm Based on the Partition of Unity for Incompressible Flows

2014 ◽  
Vol 65 (2) ◽  
pp. 512-532 ◽  
Author(s):  
Haibiao Zheng ◽  
Jiaping Yu ◽  
Feng Shi
Keyword(s):  
Finite Element ◽  
Incompressible Flows ◽  
Partition Of Unity ◽  
Parallel Finite Element ◽  
Element Algorithm

Thermal-stress analysis and calculation of single and dual chip set double-sided circuit board based on three-dimensional finite element algorithm

Circuit World ◽  
2015 ◽  
Vol 41 (2) ◽  
pp. 49-54
Author(s):  
Lan Song ◽  
Yang Zhao ◽  
Yaoming Zhou ◽  
Haifei Xiang
Keyword(s):  
Finite Element ◽  
Temperature Field ◽  
Thermal Stress ◽  
Three Dimensional ◽  
Circuit Board ◽  
Content Type ◽  
Thermal Stress Field ◽  
Dimensional Finite Element ◽  
Three Dimensional Finite Element ◽  
Element Algorithm

Purpose – The purpose of this paper is to analyze and figure out the temperature field and thermal stress field with the calculation model of thermal insulation material and composite material. Design/methodology/approach – The paper adopted the three-dimensional finite element algorithm. Findings – The simulated results showed great shearing strength between the chipset and the printed circuit board. The position of chip exerts great influence on the distribution of temperature field and thermal stress field of circuit board. The reasonable distribution of chip will effectively reduce the temperature extremum and stress extremum of circuit board. Originality/value – The paper analyzes and presents a discussion of the problems relating to the density of electronic packaging. The analysis process and the method of the paper provide essential help in resolving electronic device heat problems.

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